Inventor
TOMOKO OWADA
Inventor
JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B24Bprimary
B24BMachines, devices, or processes for grinding or polishing38%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H01LSemiconductor devices19%
LOC1319%
PatentTitleYear
12,068,189Elastic membrane, substrate holding device, and polishing apparatus202411,958,163Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane2024D1021832Elastic membrane202411,745,306Polishing apparatus and method of controlling inclination of stationary ring202311,731,235Polishing apparatus and polishing method2023D0989012Elastic membrane202311,654,524Method of detecting abnormality of a roller which transmits a local load to a retainer ring, and polishing apparatus2023D0981969Elastic membrane for semiconductor wafer polishing apparatus202311,179,823Substrate holding apparatus, elastic membrane, polishing apparatus, and method for replacing elastic membrane2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to EBARA CORP (9)· patent assignee history
2021–2024Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| EBARA CORP | 9 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 9 | 2021–2024 |