Inventor
JUYOUN CHOI
Inventor
KR
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H05KPrinted circuits25%
PatentTitleYear
12,532,747Semiconductor package and package-on-package having different wiring insulating layers surrounding differential signal wiring layers202612,482,764Semiconductor package including power plane connecting power terminal of passive device unit and dummy bump of interposer202512,255,160Semiconductor package and package-on-package including the same2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (3)· patent assignee history
2025–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 3 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 3 | 2025–2026 |