Inventor

CHAO-WEN SHIH

Inventor

TW

Overview

2021–2026

Patent span

Electricity

Primary field (CPC H)

Patents· 58 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary

H01LSemiconductor devices30%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1024%

H01QAntennas, i.e. radio aerials6%

H10DInorganic electric semiconductor devices5%

G06VImage or video recognition or understanding2%

H01PWaveguides1%

B24BMachines, devices, or processes for grinding or polishing1%

PatentTitleYear

12,564,108Package structure and method of fabricating the same2026 12,557,661Package structure with antenna element2026 12,538,814Semiconductor structure with a bridge embedded therein and method manufacturing the same2026 12,533,766Simplified carrier removable by reduced number of CMP processes2026 12,506,058Multi-liner TSV structure and method forming same2025 12,489,077Semiconductor structure and method manufacturing the same2025 12,463,133Semiconductor structure and manufacturing method thereof2025 12,451,426Conductive traces in semiconductor devices and methods of forming same2025 12,406,965Package2025 12,355,008Methods of fabricating package structure2025 12,288,752Semiconductor packages2025 12,272,674Stacking structure, package structure and method of fabricating the same2025 12,266,847Semiconductor packages and manufacturing methods thereof2025 12,266,619Integrated devices in semiconductor packages and methods of forming same2025 12,224,265Three-dimensional stacking structure and manufacturing method thereof2025 12,154,875Package and method of fabricating the same2024 12,154,897Package structures2024 12,148,664Semiconductor device and method having a through substrate via and an interconnect structure2024 12,125,821Package having multiple chips integrated therein and manufacturing method thereof2024 12,125,819Die on die bonding structure2024 12,119,328Methods of fabricating the same die stack structure and semiconductor structure2024 12,094,852Package structure and method of manufacturing the same2024 12,057,415Semiconductor device having antenna and manufacturing method thereof2024 12,057,439Integrated circuit packages2024 12,057,437Package structure, chip structure and method of fabricating the same2024 12,051,673Package having multiple chips integrated therein and manufacturing method thereof2024 12,046,579Package having bonding layers2024 12,015,013Die stack structure, semiconductor structure and method of fabricating the same2024 12,009,575Package structure2024 11,916,012Manufacturing method of semiconductor structure2024 11,894,299Conductive traces in semiconductor devices and methods of forming same2024 11,894,309System on integrated chips (SoIC) and semiconductor structures with integrated SoIC2024 11,855,333Semiconductor packages and manufacturing methods thereof2023 11,823,989Multi-liner TSV structure and method forming same2023 11,810,897Package structure and method of fabricating the same2023 11,784,163Stacking structure, package structure and method of fabricating the same2023 11,749,626Integrated devices in semiconductor packages and methods of forming same2023 11,742,297Semiconductor packages2023 11,715,723Wafer on wafer bonding structure2023 11,705,411Chip package with antenna element2023 11,705,409Semiconductor device having antenna on chip package and manufacturing method thereof2023 11,658,069Method for manufacturing a semiconductor device having an interconnect structure over a substrate2023 11,658,392Package structure2023 11,587,894Package and method of fabricating the same2023 11,562,983Package having multiple chips integrated therein and manufacturing method thereof2023 11,552,074Package structures and methods of fabricating the same2023 11,515,618Semiconductor packages and manufacturing methods thereof2022 11,502,062Integrated circuit package and method2022 11,417,629Three-dimensional stacking structure and manufacturing method thereof2022 11,335,655Package structure and manufacturing method thereof2022 11,322,477Package structure and method of fabricating the same2022 11,282,810Integrated fan-out package and manufacturing method thereof2022 11,264,362Semiconductor structure and method of fabricating the same2022 11,244,896Package structure and manufacturing method thereof2022 11,245,176Package structure, electronic device and method of fabricating package structure2022 11,233,035Package structure and method of manufacturing the same2022 11,177,355Semiconductor structure and manufacturing method thereof2021 11,164,848Semiconductor structure and method manufacturing the same2021

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (58)· patent assignee history

2021–2026Based in TW· patent location history

2024Patents assigned to TAIWAN SEMICONDUCTOR LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	58	2021–2026
TAIWAN SEMICONDUCTOR LTD	1	2024

Locations

Location	Patents	Span
TW	58	2021–2026