Inventor
Taku Sato
Inventor
Tokyo, JP
Overview
Patents· 20 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H10DInorganic electric semiconductor devices12%
G11BInformation storage based on relative movement between record carrier and transducer9%
H01LSemiconductor devices9%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
G03GElectrography6%
A41CCorsets3%
A61BDiagnosis3%
A61FFilters implantable into blood vessels3%
A61NElectrotherapy3%
PatentTitleYear
10,948,838Electrophotographic photosensitive member, process cartridge and electrophotographic apparatus202110,734,508Compound semiconductor device202010,229,912Semiconductor device201910,115,802Manufacturing method for compound semiconductor device20189,639,037'Image forming apparatus in which fixing is limited to temperatures of a predetermined range'20179,584,114'Semiconductor switch'20179,434,936'Method for removing cells'20168,466,566'Semiconductor device, method for manufacturing of semiconductor device, and switching circuit'20137,952,081'Device for determining aim position of charged particle beam, method of using the device, and treatment device employing device for determining aim position'20117,380,251'Disk apparatus'20087,185,346'Low-profile disk unit'20076,731,580'Disk unit with dual release mechanism for releasing cover retaining member'2004D0478588'Optical disc memory'20036,467,666'Method of producing a semiconductor device'20026,011,303'Electronic component'20005,970,322'Ultrahigh-frequency electronic component and method of manufacturing the same'19995,956,574'Lead frame flash removing method and apparatus'19995,904,501'Hollow package manufacturing method'19995,905,301'Mold package for sealing a chip'19995,889,232'Ultrahigh-frequency electronic component'1999Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1999–2002Patents assigned to NEC CORP (7)· patent assignee history
1999–2020Based in Tokyo, JP· patent location history
2003–2008Patents assigned to TEAC CORP (4)· patent assignee history
2004–2007Based in Kodaira, JP· patent location history
2013–2020Patents assigned to ADVANTEST CORP (5)· patent assignee history
2013–2016Patents assigned to SATO TAKU (2)· patent assignee history
2013–2019Based in Miyagi, JP· patent location history
2017Based in Hachioji, JP· patent location history
2021Patents assigned to CANON KK (1)· patent assignee history
2021Based in Numazu, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NEC CORP | 7 | 1999–2002 |
| ADVANTEST CORP | 5 | 2013–2020 |
| TEAC CORP | 4 | 2003–2008 |
| SATO TAKUself | 2 | 2013–2016 |
| CANON KK | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 12 | 1999–2020 |
| Miyagi, JP | 2 | 2013–2019 |
| Kodaira, JP | 2 | 2004–2007 |
| Numazu, JP | 1 | 2021 |
| Hachioji, JP | 1 | 2017 |