Inventor
Shigehisa Motowaki
Inventor
Hitachi, JP
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H05KPrinted circuits12%
Y10TTechnical subjects covered by former us classification8%
H01BCables6%
H01CResistors6%
B29CShaping or joining of plastics4%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
H01LSemiconductor devices4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%
B22FWorking metallic powder2%
PatentTitleYear
9,209,044'Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part'20159,136,244'Semiconductor package having a metal member and a resin mold, which are bonded to a silane coupling agent and an intermediate layer of an oxide film'20158,629,352'Enameled insulated wire and manufacturing method thereof'20148,492,202'Semiconductor device and method of manufacturing the same'20138,313,983'Fabrication method for resin-encapsulated semiconductor device'20128,314,484'Semiconductor device and method of manufacturing the same'20128,303,854'Sintering silver paste material and method for bonding semiconductor chip'20127,964,975'Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them'20117,586,755'Electronic circuit component'20097,535,106'Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate'20097,520,742'Nanoprint equipment and method of making fine structure'20097,341,441'Nanoprint equipment and method of making fine structure'20087,183,650'Wiring glass substrate for connecting a semiconductor chip to a printed wiring substrate and a semiconductor module having the wiring glass substrate'20077,047,052'Cellular phone terminal'20066,840,833'Gas discharge type display panel and production method therefor'20055,764,129'Ceramic resistor, production method thereof, neutral grounding resistor and circuit breaker'19985,614,138'Method of fabricating non-linear resistor'19975,610,570'Voltage non-linear resistor and fabricating method thereof'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2015Patents assigned to HITACHI LTD (13)· patent assignee history
1997–2014Based in Hitachi, JP· patent location history
2011–2015Based in Mito, JP· patent location history
2012–2015Patents assigned to KAJIWARA RYOICHI (5)· patent assignee history
2012–2015Patents assigned to MOTOWAKI SHIGEHISA (5)· patent assignee history
2012–2015Patents assigned to ASAUMI YUSUKE (2)· patent assignee history
2012–2013Patents assigned to RENESAS ELECTRONICS CORP (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HITACHI LTD | 13 | 1997–2015 |
| KAJIWARA RYOICHI | 5 | 2012–2015 |
| MOTOWAKI SHIGEHISAself | 5 | 2012–2015 |
| ASAUMI YUSUKE | 2 | 2012–2015 |
| RENESAS ELECTRONICS CORP | 2 | 2012–2013 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hitachi, JP | 11 | 1997–2014 |
| Mito, JP | 7 | 2011–2015 |