Inventor

Henry F. Breit

Inventor

Attleboro, MA, US

Overview

20→

Patents

1983–2008

Patent span

Electricity

Primary field (CPC H)

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%

Y10TTechnical subjects covered by former us classification20%

H05KPrinted circuits10%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%

B22FWorking metallic powder2%

B23KSoldering or unsoldering2%

B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form2%

B82YSpecific uses or applications of nanostructures2%

C04BLime, magnesia2%

C22CAlloys2%

PatentTitleYear

7,416,789'Refractory metal substrate with improved thermal conductivity'2008 5,653,379'Clad metal substrate'1997 5,536,906'Package for integrated circuits'1996 5,435,058'Hybrid/microwave enclosures and method of making same'1995 5,422,788'Technique for enhancing adhesion capability of heat spreaders in molded packages'1995 5,362,680'Technique for enhancing adhesion capability of heat spreaders in molded packages'1994 5,359,224'Insulated lead frame for integrated circuits and method of manufacture thereof'1994 5,310,520'Circuit system, a composite material for use therein, and a method of making the material'1994 5,276,423'Circuit units, substrates therefor and method of making'1994 5,138,114'Hybrid/microwave enclosures and method of making same'1992 5,126,511'Copper cored enclosures for hybrid circuits'1992 5,055,967'Substrate for an electrical circuit system and a circuit system using that substrate'1991 5,050,040'Composite material, a heat-dissipating member using the material in a circuit system, the circuit system'1991 5,039,335'Composite material for a circuit system and method of making'1991 5,036,584'Method of manufacture of copper cored enclosures for hybrid circuits'1991 4,994,903'Circuit substrate and circuit using the substrate'1991 4,894,293'Circuit system, a composite metal material for use therein, and a method for making the material'1990 4,811,166'Heat dissipating member for mounting a semiconductor device and electrical circuit unit incorporating the member'1989 4,598,473'Process for producing reinforced structural articles and articles produced thereby'1986 4,384,234'Spark plug with heat conducting sleeve for center electrode'1983

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1983–1997Patents assigned to TEXAS INSTRUMENTS INC (19)· patent assignee history

1983–2008Based in Attleboro, MA, US· patent location history

2008Patents assigned to STARCK H C INC (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TEXAS INSTRUMENTS INC	19	1983–1997
STARCK H C INC	1	2008

Locations

Location	Patents	Span
Attleboro, Massachusetts, US	20	1983–2008