Inventor

Cheng-Kuang Sun

Inventor

Hsinchu, TW

Overview

15→

Patents

2005–2019

Patent span

Electricity

Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Fprimary

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation29%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%

G06FElectric digital data processing9%

H01LSemiconductor devices9%

H10KOrganic electric solid-state devices9%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution9%

H04NPictorial communication, e.g. television6%

A61BDiagnosis3%

F24FAir-conditioning3%

G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%

PatentTitleYear

10,302,484Optical sensor module2019 10,134,989Optical discs as low-cost, quasi-random nanoimprinting templates for photon management2018 9,786,845'Optical discs as low-cost, quasi-random nanoimprinting templates for photon management'2017 8,766,916'Pointing device with multiple view angles'2014 8,749,483'Control device and control method for image display'2014 8,116,912'Control device and control method of temperature controller'2012 7,663,693'Camera module'2010 7,531,381'Manufacturing method of a quad flat no-lead package structure'2009 7,359,002'Camera module and method for packaging the same'2008 7,291,908'Quad flat no-lead package structure and manufacturing method thereof'2007 7,091,585'Process for manufacturing semiconductor device'2006 7,060,592'Image sensor and fabricating method thereof'2006 7,009,287'Chip on photosensitive device package structure and electrical connection thereof'2006 6,930,398'Package structure for optical image sensing integrated circuits'2005 6,921,681'Process for manufacturing photosensitive module'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005–2010Patents assigned to UNITED MICROELECTRONICS CORP (9)· patent assignee history

2005–2019Based in Hsinchu, TW· patent location history

2012–2014Patents assigned to PIXART IMAGING INC (3)· patent assignee history

2012–2014Patents assigned to LIN CHO YI (2)· patent assignee history

2012–2014Patents assigned to SUN CHENG KUANG (2)· patent assignee history

2017–2018Patents assigned to UNIV NORTHWESTERN (2)· patent assignee history

2017–2018Based in Wilmette, IL, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
UNITED MICROELECTRONICS CORP	9	2005–2010
PIXART IMAGING INC	3	2012–2014
LIN CHO YI	2	2012–2014
SUN CHENG KUANGself	2	2012–2014
UNIV NORTHWESTERN	2	2017–2018

Locations

Location	Patents	Span
Hsinchu, TW	13	2005–2019
Wilmette, Illinois, US	2	2017–2018