Inventor
Jungihl Kim
Inventor
Seoul, KR
Overview
Patents· 13 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1018%
Y10TTechnical subjects covered by former us classification18%
H05KPrinted circuits16%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests12%
H01BCables10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds6%
H01RElectrically-conductive connections6%
B24CAbrasive or related blasting with particulate material4%
C03CChemical composition of glasses, glazes or vitreous enamels2%
C04BLime, magnesia2%
PatentTitleYear
5,599,582'Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier'19975,582,858'Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier'19965,337,475'Process for producing ceramic circuit structures having conductive vias'19945,326,643'Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier'19945,283,104'Via paste compositions and use thereof to form conductive vias in circuitized ceramic substrates'19945,185,073'Method of fabricating nendritic materials'19935,170,245'Semiconductor device having metallic interconnects formed by grit blasting'19925,137,461'Separable electrical connection technology'19925,053,272'Optical storage device'19914,975,079'Connector assembly for chip testing'19904,896,464'Formation of metallic interconnects by grit blasting'19904,781,970'Strengthening a ceramic by post sinter coating with a compressive surface layer'19884,751,349'Zirconium as an adhesion material in a multi-layer metallic structure'1988Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1988–1997Patents assigned to IBM (13)· patent assignee history
1988–1992Based in Peekskill, NY, US· patent location history
1990–1993Based in Chappaqua, NY, US· patent location history
1991Based in Peeskill, NY, US· patent location history
1994–1997Based in Seoul, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 13 | 1988–1997 |
Locations
| Location | Patents | Span |
|---|---|---|
| Seoul, KR | 5 | 1994–1997 |
| Peekskill, New York, US | 4 | 1988–1992 |
| Chappaqua, New York, US | 3 | 1990–1993 |
| Peeskill, New York, US | 1 | 1991 |