Inventor
OHGUK KWON
Inventor
KR
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices44%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1039%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation11%
H04NPictorial communication, e.g. television6%
PatentTitleYear
12,538,803Semiconductor package including a barrier structure covering connection pads and contacting a protruding portion of an adhesive layer202611,990,452Semiconductor package202411,887,913Integrated circuit device and semiconductor package including the same202411,735,566Semiconductor package202311,710,757Semiconductor package and method of fabricating the same202311,626,385Semiconductor package202311,545,512Image sensor package with underfill and image sensor module including the same202311,545,417Integrated circuit device and semiconductor package including the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (8)· patent assignee history
2023–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 8 | 2023–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 8 | 2023–2026 |