Inventor

Hodaka Mori

Inventor
Kariya, JP

Overview

3→
Patents
2019–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B29Cprimary
B29CShaping or joining of plastics21%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts14%
H01LSemiconductor devices14%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
B29LIndexing scheme associated with subclass b29c, relating to particular articles7%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form7%
B81BMicrostructural devices or systems, e.g. micromechanical devices7%
C08JWorking-up7%
Y10TTechnical subjects covered by former us classification7%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2019–2020Patents assigned to DENSO CORP (3)· patent assignee history
2019–2020Based in Kariya, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DENSO CORP32019–2020
Locations
LocationPatentsSpan
Kariya, JP32019–2020