Inventor
RAYMUNDO M. CAMENFORTE
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices28%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1028%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H05KPrinted circuits11%
H10DInorganic electric semiconductor devices11%
PatentTitleYear
12,588,494Die stitching and harvesting of arrayed structures202612,165,956Molded silicon on passive package202412,074,077Flexible package architecture concept in fanout202411,728,266Die stitching and harvesting of arrayed structures202311,395,408Wafer-level passive array packaging2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to APPLE INC (5)· patent assignee history
2022–2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLE INC | 5 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2022–2026 |