Inventor

Lawrence E. Crowe

Inventor

Lindenwood, IL, US

Overview

19→

Patents

1987–1998

Patent span

Electricity

Primary field (CPC H)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%

H05KPrinted circuits15%

H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems10%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests10%

H02KDynamo-electric machines8%

F28FDetails of heat-exchange and heat-transfer apparatus, of general application5%

Y10TTechnical subjects covered by former us classification5%

F25BRefrigeration machines, plants or systems3%

F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%

H01GCapacitors3%

PatentTitleYear

5,749,413'Heat exchanger for high power electrical component and package incorporating same'1998 5,660,227'Heat exchanger for high power electrical component'1997 5,466,974'Electric power distribution module for an electric power generation and distribution system'1995 5,271,248'Dual cooling system'1993 5,184,291'Converter and inverter support module'1993 5,119,286'Modular circuit board'1992 5,053,358'Method of manufacturing hermetically sealed compression bonded circuit assemblies'1991 5,034,803'Compression bonded semiconductor device having a plurality of stacked hermetically sealed circuit assemblies'1991 4,985,752'Hermetically sealed compression bonded circuit assembly having a suspension for compression bonded semiconductor elements'1991 4,979,090'Power converter circuit board'1990 4,975,825'Stacked power converter'1990 4,975,824'Power converter circuit board'1990 4,954,876'Hermetically sealed compression bonded circuit assembly having flexible walls at points of application of pressure for compression bonding circuit elements'1990 4,944,344'Hermetically sealed modular electronic cold plate utilizing reflux cooling'1990 4,941,530'Enhanced air fin cooling arrangement for a hermetically sealed modular electronic cold plate utilizing reflux cooling'1990 4,935,842'High current feed-through capacitor'1990 4,901,201'Plate fin/chic heat exchanger'1990 4,830,979'Method of manufacturing hermetically sealed compression bonded circuit assemblies'1989 4,712,384'Integrated evaporator and thermal expansion valve assembly'1987

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1987–1998Patents assigned to SUNDSTRAND CORP (18)· patent assignee history

1987–1998Based in Lindenwood, IL, US· patent location history

1993Patents assigned to CROWE LAWRENCE E (1)· patent assignee history

1993Patents assigned to METZLER MARK W (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SUNDSTRAND CORP	18	1987–1998
CROWE LAWRENCE Eself	1	1993
METZLER MARK W	1	1993

Locations

Location	Patents	Span
Lindenwood, Illinois, US	19	1987–1998