Inventor

Aizou Kaneda

Inventor

Yokohama, JP

Overview

2000–2010

Patent span

Electricity

Primary field (CPC H)

Patents· 14 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1047%

Y10TTechnical subjects covered by former us classification23%

C08LCompositions of macromolecular compounds10%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices7%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%

C09DCoating compositions, e.g. paints, varnishes or lacquers3%

C09JAdhesives3%

PatentTitleYear

7,781,896'Semiconductor device and process for fabrication thereof'2010 7,560,307'Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same'2009 7,387,914'Semiconductor device and process for fabrication thereof'2008 7,078,094'Semiconductor device and process for fabrication thereof'2006 7,061,081'Resin composition, heat-resistant resin paste and semiconductor device using them and method for manufacture thereof'2006 7,057,265'Semiconductor device and process for fabrication thereof'2006 7,012,320'Semiconductor device and process for fabrication thereof'2006 6,855,579'Semiconductor device and process for fabrication thereof'2005 6,825,249'Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device'2004 6,717,242'Semiconductor device and process for fabrication thereof'2004 6,611,064'Semiconductor device and method for manufacturing the same'2003 6,404,068'Paste composition, and protective film and semiconductor device both obtained with the same'2002 6,223,429'Method of production of semiconductor device'2001 6,099,678'Laminating method of film-shaped organic die-bonding material, die-bonding method, laminating machine and die-bonding apparatus, semiconductor device, and fabrication process of semiconductor device'2000

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2000–2010Patents assigned to HITACHI CHEMICAL CO LTD (14)· patent assignee history

2000–2010Based in Yokohama, JP· patent location history

2008Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
HITACHI CHEMICAL CO LTD	14	2000–2010

Locations

Location	Patents	Span
Yokohama, JP	13	2000–2010
Kanagawa, JP	1	2008