Inventor
Rongwei Zhang
Inventor
Dallas, TX, US
Overview
Patents· 17 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01BCables6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
B29CShaping or joining of plastics4%
B82YSpecific uses or applications of nanostructures4%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients4%
H10DInorganic electric semiconductor devices4%
C09JAdhesives2%
H01FMagnets2%
PatentTitleYear
10,784,188Methods and apparatus for a semiconductor device having bi-material die attach layer202010,727,085Printed adhesion deposition to mitigate integrated circuit package delamination202010,559,5242-step die attach for reduced pedestal size of laminate component packages202010,366,944Methods and apparatus for semiconductor device having bi-material die attach layer201910,347,508Printed adhesion deposition to mitigate integrated circuit delamination201910,312,212Self-adhesive die201910,199,348Plastic-packaged semiconductor device having wires with polymerized insulating layer201910,083,896Methods and apparatus for a semiconductor device having bi-material die attach layer20189,780,060'Packaged IC with solderable sidewalls'20179,780,017'Packaged device with additive substrate surface modification'20179,601,414'Method for preventing die pad delamination'20179,524,926'Packaged device with additive substrate surface modification'20169,490,043'Highly conductive electrically conductive adhesives'20169,378,984'Packaging a semiconductor device having wires with polymerized insulator skin'20169,305,869'Packaged semiconductor device having leadframe features as pressure valves against delamination'20169,214,440'Method for preventing die pad delamination'20158,912,637'Self-adhesive die'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2020Patents assigned to TEXAS INSTRUMENTS INC (16)· patent assignee history
2014–2019Based in Richardson, TX, US· patent location history
2015–2020Based in Dallas, TX, US· patent location history
2016Patents assigned to GEORGIA TECH RES INST (1)· patent assignee history
2016Patents assigned to WONG CHING-PING (1)· patent assignee history
2016Patents assigned to ZHANG RONGWEI (1)· patent assignee history
2016Based in Atlanta, GA, US· patent location history
2017–2020Based in Plano, TX, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TEXAS INSTRUMENTS INC | 16 | 2014–2020 |
| GEORGIA TECH RES INST | 1 | 2016 |
| WONG CHING-PING | 1 | 2016 |
| ZHANG RONGWEIself | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Dallas, Texas, US | 9 | 2015–2020 |
| Plano, Texas, US | 5 | 2017–2020 |
| Richardson, Texas, US | 2 | 2014–2019 |
| Atlanta, Georgia, US | 1 | 2016 |