Inventor
Chantal Combi
Inventor
Oggiono, IT
Overview
Patents· 18 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1022%
B81BMicrostructural devices or systems, e.g. micromechanical devices18%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure16%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems13%
H01HElectric switches7%
G06FElectric digital data processing4%
H01LSemiconductor devices4%
H04RLoudspeakers, microphones, gramophone pick-ups or like acoustic electromechanical transducers4%
H10DInorganic electric semiconductor devices4%
G01PMeasuring linear or angular speed, acceleration, deceleration, or shock2%
PatentTitleYear
RE046671'Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device'20188,847,340'Packaged sensor structure having sensor opening and package opening aligned with sensor element'20148,796,059'Method of forming electronic device that includes forming protective package to house substrate and die attached thereto while leaving first and second active surface portions of the die exposed'20148,546,895'Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type'20138,134,214'Electronic device, system, and method comprising differential sensor MEMS devices and drilled substrates'20128,049,287'Substrate-level assembly for an integrated device, manufacturing process thereof and related integrated device'20118,044,929'Analog data-input device provided with a pressure sensor of a microelectromechanical type'20118,043,881'Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type'20117,928,960'Analog input device with integrated pressure sensor and electronic apparatus equipped with said input device'20117,875,942'Electronic device including MEMS devices and holed substrates, in particular of the LGA or BGA type'20117,678,600'Process for manufacturing a membrane of semiconductor material integrated in, and electrically insulated from, a substrate'20107,489,004'Micro-electro-mechanical variable capacitor for radio frequency applications with reduced influence of a surface roughness'20097,421,904'Assembly of an integrated device enabling a facilitated fluidic connection to regions of the device'20087,343,805'Surface acoustic wave pressure sensor'20087,322,236'Process for manufacturing a triaxial piezoresistive accelerometer and relative pressure-monitoring device'20087,242,066'Manufacturing method of a microelectromechanical switch'20077,022,542'Manufacturing method of a microelectromechanical switch'20066,869,856'Process for manufacturing a semiconductor wafer integrating electronic devices including a structure for electromagnetic decoupling'2005Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2005–2018Patents assigned to ST MICROELECTRONICS SRL (18)· patent assignee history
2005–2018Based in Oggiono, IT· patent location history
2011–2013Patents assigned to STMICROELECTRONICS MALTA LTD (3)· patent assignee history
2012–2014Patents assigned to BALDO LORENZO (3)· patent assignee history
2012–2014Patents assigned to COMBI CHANTAL (3)· patent assignee history
2012–2014Patents assigned to CORTESE MARIO FRANCESCO (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ST MICROELECTRONICS SRL | 18 | 2005–2018 |
| BALDO LORENZO | 3 | 2012–2014 |
| COMBI CHANTALself | 3 | 2012–2014 |
| STMICROELECTRONICS MALTA LTD | 3 | 2011–2013 |
| CORTESE MARIO FRANCESCO | 2 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Oggiono, IT | 18 | 2005–2018 |