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Inventor

Tommy Pan

Inventor
Taipei, TW

Overview

4→
Patents
2010–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1022%
H01LSemiconductor devices11%
H05KPrinted circuits11%
Y02PClimate change mitigation technologies in the production or processing of goods11%
PatentTitleYear
9,698,120'Package process and package structure'20178,618,645'Package process and package structure'20138,446,000'Package structure and package process'20137,791,211'Flip chip package structure and carrier thereof'2010

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2010–2017Patents assigned to ADVANCED SEMICONDUCTOR ENG (3)· patent assignee history
2010–2017Based in Taipei, TW· patent location history
2013Patents assigned to CHEN JEN-CHUAN (2)· patent assignee history
2013Patents assigned to PAN TOMMY (2)· patent assignee history
2013Patents assigned to SHEN CHI-CHIH (2)· patent assignee history
2013Patents assigned to CHANG HUI-SHAN (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
ADVANCED SEMICONDUCTOR ENG32010–2017
CHEN JEN-CHUAN22013
PAN TOMMYself22013
SHEN CHI-CHIH22013
CHANG HUI-SHAN12013
Locations
LocationPatentsSpan
Taipei, TW42010–2017