Inventor

Bainian Qian

Inventor
Newark, NJ, US

Overview

35→
Patents
2009–2020
Patent span
Performing operations
Primary field (CPC B)

Patents· 35 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B24Bprimary
B24BMachines, devices, or processes for grinding or polishing23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
B24DTools for grinding, buffing or sharpening10%
H01LSemiconductor devices10%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds9%
G02BOptical elements, systems or apparatus6%
H01FMagnets6%
B29CShaping or joining of plastics4%
C08JWorking-up3%
Y10TTechnical subjects covered by former us classification3%
PatentTitleYear
10,875,144Chemical mechanical polishing pad202010,722,999High removal rate chemical mechanical polishing pads and methods of making202010,625,393Chemical mechanical polishing pads having offset circumferential grooves for improved removal rate and polishing uniformity202010,464,187High removal rate chemical mechanical polishing pads from amine initiated polyol containing curatives201910,391,606Chemical mechanical polishing pads for improved removal rate and planarization201910,144,115Method of making polishing layer for chemical mechanical polishing pad201810,105,825Method of making polishing layer for chemical mechanical polishing pad201810,092,998Method of making composite polishing layer for chemical mechanical polishing pad201810,011,002Method of making composite polishing layer for chemical mechanical polishing pad20189,776,300'Chemical mechanical polishing pad and method of making same'20179,731,398'Polyurethane polishing pad'20179,630,293'Chemical mechanical polishing pad composite polishing layer formulation'20179,586,304'Controlled-expansion CMP PAD casting method'20179,586,305'Chemical mechanical polishing pad and method of making same'20179,539,694'Composite polishing layer chemical mechanical polishing pad'20179,481,070'High-stability polyurethane polishing pad'20169,484,212'Chemical mechanical polishing method'20169,475,168'Polishing pad window'20169,457,449'Chemical mechanical polishing pad with composite polishing layer'20169,452,507'Controlled-viscosity CMP casting method'20169,446,498'Chemical mechanical polishing pad with window'20169,333,620'Chemical mechanical polishing pad with clear endpoint detection window'20169,314,897'Chemical mechanical polishing pad with endpoint detection window'20169,259,820'Chemical mechanical polishing pad with polishing layer and window'20169,259,821'Chemical mechanical polishing layer formulation with conditioning tolerance'20169,238,295'Soft and conditionable chemical mechanical window polishing pad'20169,238,296'Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer'20169,233,451'Soft and conditionable chemical mechanical polishing pad stack'20169,216,489'Chemical mechanical polishing pad with endpoint detection window'20159,144,880'Soft and conditionable chemical mechanical polishing pad'20159,102,034'Method of chemical mechanical polishing a substrate'20159,064,806'Soft and conditionable chemical mechanical polishing pad with window'20158,980,749'Method for chemical mechanical polishing silicon wafers'20158,163,114'Netshape manufacturing processes and compositions'20127,632,086'Melt fracture reduction'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2020Based in Newark, NJ, US· patent location history
2012Patents assigned to DAVE RAJESH (1)· patent assignee history
2015–2020Patents assigned to DOW GLOBAL TECHNOLOGIES LLC (25)· patent assignee history
2015–2016Patents assigned to ROHM & HAAS ELECT MAT (12)· patent assignee history
2015–2020Patents assigned to NITTA HAAS INC (2)· patent assignee history
2016–2020Patents assigned to ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC (21)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
DOW GLOBAL TECHNOLOGIES LLC252015–2020
ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC212016–2020
ROHM & HAAS ELECT MAT122015–2016
NITTA HAAS INC22015–2020
DAVE RAJESH12012
Locations
LocationPatentsSpan
Newark, New Jersey, US352009–2020