Inventor
Hideki Kitada
Inventor
Kawasaki, JP
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1024%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
B61FRail vehicle suspensions, e.g. underframes, bogies or arrangements of wheel axles8%
F16FSprings8%
G06FElectric digital data processing6%
G06NComputing arrangements based on specific computational models6%
G06QInformation and communication technology [ict] specially adapted for administrative, commercial, financial, managerial or supervisory purposes5%
H04LTransmission of digital information, e.g. telegraphic communication5%
H01LSemiconductor devices4%
H04NPictorial communication, e.g. television3%
PatentTitleYear
11,120,342Electronic meeting intelligence202111,080,466Updating existing content suggestion to include suggestions from recorded media using artificial intelligence202111,062,271Interactive whiteboard appliances with learning capabilities202110,956,875Attendance tracking, presentation files, meeting services and agenda extraction for interactive whiteboard appliances202110,915,823System for automatic classification and routing202110,901,719Approach for designing skills for cognitive agents across multiple vendor platforms202110,904,487Integration of videoconferencing with interactive electronic whiteboard appliances202110,597,050Air spring and bogie202010,563,719Air spring and bogie202010,538,257Air spring and bogie202010,449,979Air spring and bogie201910,435,044Air spring and bogie201910,383,229Electronic apparatus, fabrication method therefor and electronic part201910,319,667Electronic device and method of fabricating the same201910,008,436Semiconductor device20189,202,752'Semiconductor device with first and second semiconductor substrates'20158,836,122'Semiconductor device having copper wiring with increased migration resistance'20148,540,220'Air spring for vehicle and railway truck for vehicle'20138,383,509'Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy and semiconductor device of this kind'20138,319,277'Semiconductor device, method of manufacturing same, and apparatus for designing same'20128,071,474'Method of manufacturing semiconductor device suitable for forming wiring using damascene method'20117,871,924'Semiconductor device having copper wiring'20117,868,456'Semiconductor device and method for fabricating the same'20117,846,833'Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device'20107,795,141'Method of manufacturing semiconductor device suitable for forming wiring using damascene method'20107,713,869'Manufacture method for semiconductor device suitable for forming wirings by damascene method and semiconductor device'20107,670,925'Semiconductor device, method of manufacturing same, and apparatus for designing same'20107,611,984'Manufacture method for semiconductor device having improved copper diffusion preventive function of plugs and wirings made of copper or copper alloy'20097,507,666'Manufacture method for semiconductor device having concave portions filled with conductor containing Cu as its main composition'20097,416,985'Semiconductor device having a multilayer interconnection structure and fabrication method thereof'20087,413,977'Method of manufacturing semiconductor device suitable for forming wiring using damascene method'20087,329,952'Method of fabricating a semiconductor device'20087,279,790'Semiconductor device and a manufacturing method thereof'20077,205,667'Semiconductor device having copper wiring'20076,257,561'Air spring'20016,242,808'Semiconductor device with copper wiring and semiconductor device manufacturing method'20014,808,642'Chlorine-containing resin molding and material for use therewith'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–2020Based in Osaka, JP· patent location history
2001–2019Patents assigned to FUJITSU LTD (16)· patent assignee history
2001–2020Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (7)· patent assignee history
2001–2015Based in Kawasaki, JP· patent location history
2018–2019Based in Atsugi, JP· patent location history
2021Patents assigned to KITADA HIROSHI (7)· patent assignee history
2021Patents assigned to RICOH CO LTD (7)· patent assignee history
2021Patents assigned to WONG LANA (7)· patent assignee history
2021Based in Tuckahoe, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FUJITSU LTD | 16 | 2001–2019 |
| KITADA HIROSHIself | 7 | 2021 |
| RICOH CO LTD | 7 | 2021 |
| SUMITOMO ELECTRIC INDUSTRIES | 7 | 2001–2020 |
| WONG LANA | 7 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kawasaki, JP | 19 | 2001–2015 |
| Osaka, JP | 8 | 1989–2020 |
| Tuckahoe, New York, US | 7 | 2021 |
| Atsugi, JP | 3 | 2018–2019 |