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Inventor

Jianyou Xie

Inventor
Gansu, CN

Overview

2→
Patents
2015–2016
Patent span
Electricity
Primary field (CPC H)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H05KPrinted circuits14%
H10DInorganic electric semiconductor devices14%
Y10TTechnical subjects covered by former us classification14%
PatentTitleYear
9,349,615'SiP system-integration IC chip package and manufacturing method thereof'20169,210,813'Production method of high-density SIM card package'2015

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2015–2016Patents assigned to MU WEI (2)· patent assignee history
2015–2016Patents assigned to TIANSHUI HUATIAN TECHNOLOGY CO (2)· patent assignee history
2015–2016Patents assigned to XIE JIANYOU (2)· patent assignee history
2015Patents assigned to CHEN XIN (1)· patent assignee history
2015Patents assigned to GUO XIAOWEI (1)· patent assignee history
2015–2016Based in Gansu, CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
MU WEI22015–2016
TIANSHUI HUATIAN TECHNOLOGY CO22015–2016
XIE JIANYOUself22015–2016
CHEN XIN12015
GUO XIAOWEI12015
Locations
LocationPatentsSpan
Gansu, CN22015–2016