Inventor
Vemal Raja Manikam
Inventor
Shah Alam, MY
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1056%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1011%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
9,991,185Direct bonded copper semiconductor packages and related methods20189,659,837'Direct bonded copper semiconductor packages and related methods'20178,338,828'Semiconductor package and method of testing same'20128,237,293'Semiconductor package with protective tape'20127,989,965'Underfill dispensing system for integrated circuits'2011Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2011–2012Patents assigned to FREESCALE SEMICONDUCTOR INC (3)· patent assignee history
2011–2018Based in Shah Alam, MY· patent location history
2012Patents assigned to LOW BOON YEW (2)· patent assignee history
2012Patents assigned to MANIKAM VEMAL RAJA (2)· patent assignee history
2012Patents assigned to LAU TECK BENG (1)· patent assignee history
2017–2018Patents assigned to SEMICONDUCTOR COMPONENTS IND LLC (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| FREESCALE SEMICONDUCTOR INC | 3 | 2011–2012 |
| LOW BOON YEW | 2 | 2012 |
| MANIKAM VEMAL RAJAself | 2 | 2012 |
| SEMICONDUCTOR COMPONENTS IND LLC | 2 | 2017–2018 |
| LAU TECK BENG | 1 | 2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Shah Alam, MY | 5 | 2011–2018 |