Inventor
PETTERI PALM
Inventor
DE
Overview
Patents· 35 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
H01LSemiconductor devices26%
H05KPrinted circuits17%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h108%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems5%
Y10TTechnical subjects covered by former us classification3%
G06FElectric digital data processing2%
H01FMagnets2%
H02PControl or regulation of electric motors, electric generators or dynamo-electric converters2%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications2%
PatentTitleYear
12,431,450Device including semiconductor chips and method for producing such device202512,414,236Electronic device with castellated board202512,315,835Pre-packaged chip, method of manufacturing a pre-packaged chip, semiconductor package and method of manufacturing a semiconductor package202512,284,753Electrostatic discharge protection of electronic component embedded in laminate of printed circuit board202512,237,246Semiconductor devices including parallel electrically conductive layers202512,218,098Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate202512,176,283Die package and method of forming a die package202412,159,829Semiconductor package with non-uniformly distributed vias202412,094,807Stacked transistor chip package with source coupling202412,080,669Semiconductor device module having vertical metallic contacts and a method for fabricating the same202412,033,909Die package and method of manufacturing a die package202412,027,481Device including semiconductor chips and method for producing such device202412,014,964Semiconductor package having an electrically insulating core with exposed glass fibres202412,009,290Semiconductor module having a multi-branch switch node connector202411,996,771Power semiconductor system having an inductor module attached to a power stage module202411,978,693Semiconductor device package comprising side walls connected with contact pads of a semiconductor die202411,979,096Multiphase inverter apparatus having half-bridge circuits and a phase output lead for each half-bridge circuit202411,903,132Power electronic assembly having a laminate inlay and method of producing the power electronic assembly202411,792,941Circuit board structure and method for manufacturing a circuit board structure202311,791,255Die package and method of forming a die package202311,776,882Method of fabricating a semiconductor package202311,664,304Semiconductor module202311,632,860Power electronic assembly and method of producing thereof202311,569,186Device including semiconductor chips and method for producing such device202311,539,291Method of manufacturing a power semiconductor system202211,532,541Semiconductor package having a solderable contact pad formed by a load terminal bond pad of a power semiconductor die202211,502,012Semiconductor packages and methods of manufacturing thereof202211,469,164Space efficient and low parasitic half bridge202211,444,017Semiconductor package and method of manufacturing a semiconductor package202211,430,669Forming a lock structure in a semiconductor chip pad202211,373,944Die package and method of forming a die package202211,348,861Semiconductor package and method of manufacturing a semiconductor package202211,309,277Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrate202211,302,610Semiconductor package and method of fabricating a semiconductor package202211,303,222Multiphase inverter apparatus2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to INFINEON TECHNOLOGIES AG (22)· patent assignee history
2022–2024Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (12)· patent assignee history
2022–2025Based in DE· patent location history
2023Patents assigned to IMBERATEK LLC (1)· patent assignee history
2024Patents assigned to INFINEON TECHNOLOGIES AMERICAS CORP (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 22 | 2022–2025 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 12 | 2022–2024 |
| IMBERATEK LLC | 1 | 2023 |
| INFINEON TECHNOLOGIES AMERICAS CORP | 1 | 2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 35 | 2022–2025 |