Inventor
Robert J. Kelleher
Inventor
Endicott, NY, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1044%
H01RElectrically-conductive connections22%
H05KPrinted circuits22%
Y10TTechnical subjects covered by former us classification11%
PatentTitleYear
6,046,911'Dual substrate package assembly having dielectric member engaging contacts at only three locations'20005,953,214'Dual substrate package assembly coupled to a conducting member'19995,266,520'Electronic packaging with varying height connectors'19935,173,763'Electronic packaging with varying height connectors'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992–2000Patents assigned to IBM (4)· patent assignee history
1992–1993Based in Vestal, NY, US· patent location history
1999–2000Based in Endicott, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| IBM | 4 | 1992–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Endicott, New York, US | 2 | 1999–2000 |
| Vestal, New York, US | 2 | 1992–1993 |