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Inventor

Ma. Shirley Asoy

Inventor
Singapore, SG

Overview

5→
Patents
2009–2012
Patent span
Electricity
Primary field (CPC H)

Patents· 5 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1063%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10DInorganic electric semiconductor devices13%
PatentTitleYear
8,293,584'Integrated circuit package system with filled wafer recess'20127,868,434'Integrated circuit package-on-package stacking system'20117,829,384'Semiconductor device and method of laser-marking wafers with tape applied to its active surface'20107,718,472'Integrated circuit package-on-package stacking system and method of manufacture thereof'20107,535,086'Integrated circuit package-on-package stacking system'2009

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2009–2012Patents assigned to STATS CHIPPAC LTD (5)· patent assignee history
2009–2012Based in Singapore, SG· patent location history
2012Patents assigned to ASOY MA SHIRLEY (1)· patent assignee history
2012Patents assigned to GUILLERMO DENNIS (1)· patent assignee history
2012Patents assigned to MAGNO SHEILA RIMA C (1)· patent assignee history
2012Patents assigned to MARIMUTHU PANDI CHELVAM (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
STATS CHIPPAC LTD52009–2012
ASOY MA SHIRLEYself12012
GUILLERMO DENNIS12012
MAGNO SHEILA RIMA C12012
MARIMUTHU PANDI CHELVAM12012
Locations
LocationPatentsSpan
Singapore, SG52009–2012