Inventor
HAOYU ZHANG
Inventor
CN
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C07Dprimary
C07DHeterocyclic compounds15%
Y02PClimate change mitigation technologies in the production or processing of goods15%
A61KPreparations for medical, dental or toiletry purposes8%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations8%
B22FWorking metallic powder8%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering8%
C07BGeneral methods of organic chemistry8%
C07CAcyclic or carbocyclic compounds8%
C22CAlloys8%
G06FElectric digital data processing8%
PatentTitleYear
12,561,561Mapping user vectors between embeddings for a machine learning model for authorizing access to resource202611,794,248Multi-stage gas atomization preparation method of titanium alloy spherical powder for 3D printing technology202311,390,614Method for preparing benzofuran derivative202211,225,462Crystal forms of oxypyridine amide derivative and preparation method therefor2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to JIANGSU HENGRUI MEDICINE CO (2)· patent assignee history
2022Patents assigned to Shanghai hengrui pharmaceutical co ltd (2)· patent assignee history
2022–2023Based in CN· patent location history
2023Patents assigned to UNIV SHENYANG TECHNOLOGY (1)· patent assignee history
2026Patents assigned to VISA INT SERVICE ASS (1)· patent assignee history
2026Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| JIANGSU HENGRUI MEDICINE CO | 2 | 2022 |
| Shanghai hengrui pharmaceutical co ltd | 2 | 2022 |
| UNIV SHENYANG TECHNOLOGY | 1 | 2023 |
| VISA INT SERVICE ASS | 1 | 2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 3 | 2022–2023 |
| US | 1 | 2026 |