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Inventor

Puay Gek Chua

Inventor
Singapore, SG

Overview

2→
Patents
2007–2013
Patent span
Performing operations
Primary field (CPC B)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B23Kprimary
B23KSoldering or unsoldering33%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
Y10TTechnical subjects covered by former us classification33%
PatentTitleYear
8,535,980'Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package'20137,306,133'System for fabricating an integrated circuit package on a printed circuit board'2007

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2007Patents assigned to ST ASSEMBLY TEST SERVICES LTD (1)· patent assignee history
2007–2013Based in Singapore, SG· patent location history
2013Patents assigned to CHUA PUAY GEK (1)· patent assignee history
2013Patents assigned to JIN YONGGANG (1)· patent assignee history
2013Patents assigned to ST MICROELECTRONICS PTE LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
CHUA PUAY GEKself12013
JIN YONGGANG12013
ST ASSEMBLY TEST SERVICES LTD12007
ST MICROELECTRONICS PTE LTD12013
Locations
LocationPatentsSpan
Singapore, SG22007–2013