Inventor

Chao-Wen Shih

Inventor

Hsinchu County, TW

Overview

2006–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 68 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1030%

H01LSemiconductor devices24%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

H01QAntennas, i.e. radio aerials9%

H05KPrinted circuits7%

Y10TTechnical subjects covered by former us classification4%

H10DInorganic electric semiconductor devices2%

A61JContainers specially adapted for medical or pharmaceutical purposes2%

B25JManipulators1%

B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers1%

PatentTitleYear

10,879,197Package structure and method of fabricating package structure2020 10,872,842Semiconductor device and manufacturing method thereof2020 10,867,940Package structure and manufacturing method thereof2020 10,867,966Package structure, package-on-package structure and method of fabricating the same2020 10,867,929Semiconductor structures and methods of forming the same2020 10,867,882Semiconductor package, semiconductor device and method for packaging semiconductor device2020 10,756,052Method of manufacturing integrated fan-out package2020 10,741,508Semiconductor device having antenna and manufacturing method thereof2020 10,720,495Semiconductor device and manufacturing method thereof2020 10,636,713Semiconductor packages and manufacturing methods thereof2020 10,535,913Package structure, electronic device and method of fabricating package structure2020 10,510,652Method of manufacturing semiconductor device2019 10,510,693Semiconductor package structure2019 10,490,479Packaging of semiconductor device with antenna and heat spreader2019 10,483,617Package structure2019 10,475,757Package structure and manufacturing method thereof2019 10,381,309Package structure having connecting module2019 10,366,966Method of manufacturing integrated fan-out package2019 10,354,964Integrated devices in semiconductor packages and methods of forming same2019 10,327,995Automatic medicine retrieving device2019 10,319,692Semiconductor structure and manufacturing method thereof2019 10,312,209Manufacturing method of semiconductor package2019 10,312,203Structure and formation method of chip package with antenna element2019 10,276,920Package structure, electronic device and method of fabricating package structure2019 10,269,904Semiconductor structure and manufacturing method thereof2019 10,186,492Package structure and manufacturing method thereof2019 10,183,858Semiconductor structure and method of manufacturing the same2019 10,157,807Sensor packages and manufacturing mehtods thereof2018 9,953,942Semiconductor packaging and manufacturing method thereof2018 9,728,477'Method of manufacturing a semiconductor device having scribe lines'2017 9,653,341'Semiconductor structure and manufacturing method thereof'2017 9,653,406'Conductive traces in semiconductor devices and methods of forming same'2017 9,589,915'Semiconductor device and manufacturing method thereof'2017 9,543,263'Semiconductor packaging and manufacturing method thereof'2017 9,543,259'Semiconductor structure with oval shaped conductor'2017 9,530,759'3D package with through substrate vias'2016 9,484,308'Semiconductor device'2016 9,437,490'Semiconductor device and manufacturing method thereof'2016 9,431,360'Semiconductor structure and manufacturing method thereof'2016 9,397,056'Semiconductor device having trench adjacent to receiving area and method of forming the same'2016 9,379,076'Semiconductor device and manufacturing method thereof'2016 9,343,415'Copper post structure for wafer level chip scale package'2016 9,343,385'Semiconductor device comprising a chip substrate, a mold, and a buffer layer'2016 9,333,653'Automatic pill grasping apparatus and method'2016 9,305,877'3D package with through substrate vias'2016 9,284,111'Automatic pill grasping apparatus'2016 9,236,322'Methods and apparatus for heat spreader on silicon'2016 9,035,468'Copper post structure for wafer level chip scale package'2015 8,865,521'3D semiconductor package interposer with die cavity'2014 8,810,025'Reinforcement structure for flip-chip packaging'2014 8,669,651'Package-on-package structures with reduced bump bridging'2014 8,519,537'3D semiconductor package interposer with die cavity'2013 8,283,781'Semiconductor device having pad structure with stress buffer layer'2012 8,158,891'Circuit board structure and method for manufacturing the same'2012 8,070,932'Circuit board with identifiable information and method for fabricating the same'2011 8,022,530'Package substrate having electrically connecting structure'2011 7,964,801'Circuit board structure and fabrication method thereof'2011 7,948,085'Circuit board structure'2011 7,719,853'Electrically connecting terminal structure of circuit board and manufacturing method thereof'2010 7,659,193'Conductive structures for electrically conductive pads of circuit board and fabrication method thereof'2010 7,553,750'Method for fabricating electrical conductive structure of circuit board'2009 7,546,682'Methods for repairing circuit board having defective pre-soldering bump'2009 7,419,897'Method of fabricating circuit board having different electrical connection structures'2008 7,365,272'Circuit board with identifiable information and method for fabricating the same'2008 7,350,298'Method for fabricating circuit board with conductive structure'2008 7,341,934'Method for fabricating conductive bump of circuit board'2008 7,174,630'Method for fabricating connection terminal of circuit board'2007 7,151,050'Method for fabricating electrical connection structure of circuit board'2006

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2006–2010Patents assigned to PHOENIX PREC TECHNOLOGY CORP (10)· patent assignee history

2006–2020Based in Hsinchu, TW· patent location history

2011–2016Patents assigned to SHIH CHAO-WEN (7)· patent assignee history

2011–2012Patents assigned to UNIMICRON TECHNOLOGY CORP (5)· patent assignee history

2012–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (10)· patent assignee history

2012–2020Based in Zhubei City, TW· patent location history

2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (40)· patent assignee history

2016–2020Based in Hsinchu County, TW· patent location history

2016–2019Based in New Taipei, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	40	2015–2020
PHOENIX PREC TECHNOLOGY CORP	10	2006–2010
TAIWAN SEMICONDUCTOR MFG	10	2012–2016
SHIH CHAO-WENself	7	2011–2016
UNIMICRON TECHNOLOGY CORP	5	2011–2012

Locations

Location	Patents	Span
Hsinchu County, TW	31	2016–2020
Hsinchu, TW	20	2006–2020
Zhubei City, TW	14	2012–2020
New Taipei, TW	3	2016–2019