Inventor
TINGTING CUI
Inventor
CN
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1014%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H01QAntennas, i.e. radio aerials8%
G09GArrangements or circuits for control of indicating devices using static means to present variable information6%
H10DInorganic electric semiconductor devices6%
B01LChemical or physical laboratory apparatus for general use5%
G01NInvestigating or analysing materials by determining their chemical or physical properties5%
G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein5%
H01PWaveguides5%
PatentTitleYear
12,536,967Drive circuit and drive method thereof, and panel and drive method thereof202612,107,101Package structure, packaging method, camera module, and electronic equipment202412,057,324Semiconductor package having a semiconductor element and a wiring structure202411,901,324Chip package method and chip package structure202411,826,755Panel and drive method thereof202311,824,262Antenna, phase shifter, and communication device202311,791,553Phase shifter, fabrication method thereof, and antenna202311,764,181Semiconductor package and method for fabricating the semiconductor package202311,705,643Antenna unit, antenna apparatus and electronic device202311,646,272Packaging method of panel-level chip device202311,581,196Semiconductor package having semiconductor element with pins and formation method thereof202311,545,750Phase shifter and manufacturing method thereof, antenna and manufacturing method thereof202311,380,644Semiconductor package including workpiece and method for fabricating the semiconductor package202211,376,585Drive circuit and drive method thereof, and panel and drive method thereof202211,334,740Circuit, structure, and device for fingerprint recognition, display panel, and display device202211,257,765Chip package structure including connecting posts and chip package method202211,222,907Array substrate, electronic paper display panel, drive method thereof, and display device202211,196,172Phased-array antenna and method for controlling the same202111,183,463Chip package method and chip package structure2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to SHANGHAI AVIC OPTO ELECTRONICS CO LTD (16)· patent assignee history
2021–2024Patents assigned to SHANGHAI TIANMA MICRO ELECT CO (11)· patent assignee history
2021–2023Patents assigned to CHENGDU TIANMA MICRO ELECTRONICS CO LTD (2)· patent assignee history
2021–2026Based in CN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SHANGHAI AVIC OPTO ELECTRONICS CO LTD | 16 | 2021–2026 |
| SHANGHAI TIANMA MICRO ELECT CO | 11 | 2021–2024 |
| CHENGDU TIANMA MICRO ELECTRONICS CO LTD | 2 | 2021–2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| CN | 19 | 2021–2026 |