Inventor

CHIA HUNG HSU

Inventor
US

Overview

20→
Patents
2023–2026
Patent span
LOC
Primary field

Patents· 20 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

LOC07primary
LOC0734%
LOC0910%
B29CShaping or joining of plastics7%
C08JWorking-up7%
C08LCompositions of macromolecular compounds7%
G06FElectric digital data processing7%
A43BCharacteristic features of footwear3%
B62MRider propulsion of wheeled vehicles or sledges3%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients3%
H01RElectrically-conductive connections3%

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2025Patents assigned to TAKEYA USA CORP (14)· patent assignee history
2023–2025Patents assigned to TSRC CORP (2)· patent assignee history
2023–2025Based in US· patent location history
2023–2026Based in TW· patent location history
2024Patents assigned to QNAP SYSTEMS INC (1)· patent assignee history
2025Patents assigned to MEDIATEK INC (2)· patent assignee history
2026Patents assigned to J D COMPONENTS CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAKEYA USA CORP142023–2025
MEDIATEK INC22025
TSRC CORP22023–2025
J D COMPONENTS CO LTD12026
QNAP SYSTEMS INC12024
Locations
LocationPatentsSpan
US142023–2025
TW62023–2026