Inventor
CHENG YUAN CHEN
Inventor
TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H01QAntennas, i.e. radio aerials13%
H05KPrinted circuits13%
PatentTitleYear
12,451,415Semiconductor device package, electronic assembly and method for manufacturing the same202512,412,845Semiconductor packages and methods of manufacturing the same202512,308,306Semiconductor device package and method of manufacturing the same202511,764,137Semiconductor device package, electronic assembly and method for manufacturing the same202311,658,102Semiconductor device package and method of manufacturing the same202311,552,026Semiconductor packages and methods of manufacturing the same2023Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2023–2025Patents assigned to ADVANCED SEMICONDUCTOR ENG (6)· patent assignee history
2023–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 6 | 2023–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2023–2025 |