Inventor
Eiichi Shirakawa
Inventor
Kumamoto, JP
Overview
Patents· 19 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1047%
F27DDetails or accessories of furnaces, kilns, ovens or retorts, in so far as they are of kinds occurring in more than one kind of furnace10%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices10%
G01FMeasuring volume, volume flow, mass flow or liquid level7%
G06FElectric digital data processing7%
B05CApparatus for applying fluent materials to surfaces, in general3%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact3%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light3%
G05DSystems for controlling or regulating non-electric variables3%
G09GArrangements or circuits for control of indicating devices using static means to present variable information3%
PatentTitleYear
9,021,385'Computer-readable storage medium having stored thereon display control program, display control system, display control apparatus, and display control method'20158,963,964'Computer-readable storage medium having display control program stored therein, display control method, display control system, and display control apparatus'2015RE040052'Heat treatment apparatus'20086,841,342'Substrate processing apparatus and substrate processing method'20056,753,508'Heating apparatus and heating method'20046,744,020'Heat processing apparatus'20046,644,964'Substrate processing apparatus and substrate processing method'20036,474,986'Hot plate cooling method and heat processing apparatus'20026,450,803'Heat treatment apparatus'20026,380,518'Heat treatment apparatus and substrate processing system'20026,291,800'Heat treatment apparatus and substrate processing system'20016,229,116'Heat treatment apparatus'20016,228,171'Heat processing apparatus'20016,222,161'Heat treatment apparatus'20016,191,394'Heat treating apparatus'20015,249,142'Indirect temperature-measurement of films formed on semiconductor wafers'19935,225,663'Heat process device'19935,070,813'Coating apparatus'19915,038,608'Method for measuring the flow rate of exhaust gas'1991Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1991–2008Patents assigned to TOKYO ELECTRON LTD (15)· patent assignee history
1991–1993Patents assigned to TEL KYUSHU KK (4)· patent assignee history
1991–2008Based in Kumamoto, JP· patent location history
2003–2005Based in Kikuchi-gun, JP· patent location history
2015Patents assigned to NINTENDO CO LTD (2)· patent assignee history
2015Patents assigned to SHIRAKAWA EIICHI (2)· patent assignee history
2015Patents assigned to FUJII TOMOHIRO (1)· patent assignee history
2015Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOKYO ELECTRON LTD | 15 | 1991–2008 |
| TEL KYUSHU KK | 4 | 1991–1993 |
| NINTENDO CO LTD | 2 | 2015 |
| SHIRAKAWA EIICHIself | 2 | 2015 |
| FUJII TOMOHIRO | 1 | 2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kumamoto, JP | 13 | 1991–2008 |
| Kikuchi-gun, JP | 4 | 2003–2005 |
| Kyoto, JP | 2 | 2015 |