Inventor
Mao-Hua Yeh
Inventor
Taichung, TW
Overview
Patents· 10 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1042%
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H01QAntennas, i.e. radio aerials4%
H05KPrinted circuits4%
H10DInorganic electric semiconductor devices4%
PatentTitleYear
11,081,415Method for manufacturing electronic package202110,833,394Electronic package and method for fabricating the same202010,679,914Electronic package and method for manufacturing the same20209,899,308'Semiconductor package and method of fabricating the same'20189,831,191Electronic package, semiconductor substrate of the electronic package, and method for manufacturing the electronic package20179,666,536'Package structure and fabrication method thereof'20179,607,939'Semiconductor package and method of fabricating the same'20179,502,335'Package structure and method for fabricating the same'20167,968,991'Stacked package module and board having exposed ends'20117,656,015'Packaging substrate having heat-dissipating structure'2010Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2010Patents assigned to PHOENIX PREC TECHNOLOGY CORP (1)· patent assignee history
2010–2011Based in Hsinchu, TW· patent location history
2011Patents assigned to UNIMICRON TECHNOLOGY CORP (1)· patent assignee history
2016–2021Patents assigned to SILICONWARE PRECISION INDUSTRIES CO LTD (8)· patent assignee history
2016–2021Based in Taichung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SILICONWARE PRECISION INDUSTRIES CO LTD | 8 | 2016–2021 |
| PHOENIX PREC TECHNOLOGY CORP | 1 | 2010 |
| UNIMICRON TECHNOLOGY CORP | 1 | 2011 |
Locations
| Location | Patents | Span |
|---|---|---|
| Taichung, TW | 8 | 2016–2021 |
| Hsinchu, TW | 2 | 2010–2011 |