Inventor

Bin-Ming Benjamin Tsai

Inventor
Saratoga, CA, US

Overview

56→
Patents
1989–2020
Patent span
Physics
Primary field (CPC G)

Patents· 56 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices24%
G01NInvestigating or analysing materials by determining their chemical or physical properties23%
G02BOptical elements, systems or apparatus16%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h107%
G01RMeasuring electric variables5%
G06TImage data processing or generation, in general4%
G06FElectric digital data processing3%
G06VImage or video recognition or understanding3%
G01BMeasuring length, thickness or similar linear dimensions2%
H01JElectric discharge tubes or discharge lamps2%
PatentTitleYear
10,788,759Prediction based chucking and lithography control optimization202010,325,004Method of optimizing an optical parametric model for structural analysis using optical critical dimension (OCD) metrology201910,036,964Prediction based chucking and lithography control optimization20189,377,414'EUV high throughput inspection system for defect detection on patterned EUV masks, mask blanks, and wafers'20169,310,296'Optimizing an optical parametric model for structural analysis using optical critical dimension (OCD) metrology'20168,962,351'Dopant metrology with information feedforward and feedback'20158,879,073'Optical metrology using targets with field enhancement elements'20148,832,611'Process aware metrology'20148,692,986'EUV high throughput inspection system for defect detection on patterned EUV masks, mask blanks, and wafers'20148,553,217'EUV high throughput inspection system for defect detection on patterned EUV masks, mask blanks, and wafers'20138,535,957'Dopant metrology with information feedforward and feedback'20138,468,471'Process aware metrology'20137,858,911'Confocal wafer inspection system and method'20107,773,296'Ultra-broadband UV microscope imaging system with wide range zoom capability'20107,733,111'Segmented optical and electrical testing for photovoltaic devices'20107,728,968'Excimer laser inspection system'20107,660,686'Ion implant metrology system with fault detection and identification'20107,554,655'High throughput brightfield/darkfield water inspection system using advanced optical techniques'20097,522,275'High throughput darkfield/brightfield wafer inspection system using advanced optical techniques'20097,465,913'System and method for sensing using adjustable modulation transfer function (MTF) with voltage variations relative to depletion depth at a pixel'20087,457,034'High NA system for multiple mode imaging'20087,423,805'Ultra-broadband UV microscope imaging system with wide range zoom capability'20087,399,950'Confocal wafer inspection method and apparatus using fly lens arrangement'20087,379,173'High throughput brightfield/darkfield wafer inspection system using advanced optical techniques'20087,259,844'High throughput darkfield/brightfield wafer inspection system using advanced optical techniques'20077,218,768'Inspection method and apparatus for the inspection of either random or repeating patterns'20077,164,475'High throughput brightfield/darkfield wafer inspection system using advanced optical techniques'20077,136,159'Excimer laser inspection system'20067,126,100'System and method for sensing using adjustable modulation transfer function (MTF)'20067,109,458'Confocal wafer depth scanning inspection method'20067,035,001'High NA system for multiple mode imaging'20066,956,694'Broad spectrum ultraviolet inspection systems employing catadioptric imaging'20056,867,406'Confocal wafer inspection method and apparatus using fly lens arrangement'20056,816,249'High throughput brightfield/darkfield wafer inspection system using advanced optical techniques'20046,801,357'Ultra-broadband UV microscope imaging system with wide range zoom capability'20046,771,806'Multi-pixel methods and apparatus for analysis of defect information from test structures on semiconductor devices'20046,665,432'Inspection method and apparatus for the inspection of either random or repeating patterns'20036,560,011'High NA system for multiple mode imaging'20036,524,873'Continuous movement scans of test structures on semiconductor integrated circuits'20036,483,638'Ultra-broadband UV microscope imaging system with wide range zoom capability'20026,445,199'Methods and apparatus for generating spatially resolved voltage contrast maps of semiconductor test structures'20026,433,561'Methods and apparatus for optimizing semiconductor inspection tools'20026,392,793'High NA imaging system'20026,313,467'Broad spectrum ultraviolet inspection methods employing catadioptric imaging'20016,288,780'High throughput brightfield/darkfield wafer inspection system using advanced optical techniques'20016,137,570'System and method for analyzing topological features on a surface'20006,133,576'Broad spectrum ultraviolet inspection methods employing catadioptric imaging'20006,078,386'Inspection system simultaneously utilizing monochromatic darkfield and broadband brightfield illumination sources'20006,064,517'High NA system for multiple mode imaging'20006,021,214'Inspection method and apparatus for the inspection of either random or repeating patterns'20005,999,310'Ultra-broadband UV microscope imaging system with wide range zoom capability'19995,956,174'Broad spectrum ultraviolet catadioptric imaging system'19995,822,055'Optical inspection of a specimen using multi-channel responses from the specimen using bright and darkfield detection'19985,717,518'Broad spectrum ultraviolet catadioptric imaging system'19985,537,669'Inspection method and apparatus for the inspection of either random or repeating patterns'19964,845,558'Method and apparatus for detecting defects in repeated microminiature patterns'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–2000Patents assigned to KLA INSTR CORP (8)· patent assignee history
1989Based in Santa Clara, CA, US· patent location history
1996–2007Based in San Jose, CA, US· patent location history
1998–2020Based in Saratoga, CA, US· patent location history
2000–2020Patents assigned to KLA TENCOR CORP (36)· patent assignee history
2001–2010Patents assigned to KLA TENCOR TECH CORP (7)· patent assignee history
2013–2016Patents assigned to TSAI BIN-MING BENJAMIN (4)· patent assignee history
2013–2019Patents assigned to LIU XUEFENG (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
KLA TENCOR CORP362000–2020
KLA INSTR CORP81989–2000
KLA TENCOR TECH CORP72001–2010
TSAI BIN-MING BENJAMINself42013–2016
LIU XUEFENG32013–2019
Locations
LocationPatentsSpan
Saratoga, California, US511998–2020
San Jose, California, US41996–2007
Santa Clara, California, US11989