Inventor
Hirohisa Saito
Inventor
Tokyo, JP
Overview
Patents· 21 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
A01KAnimal husbandry4%
A61PSpecific therapeutic activity of chemical compounds or medicinal preparations4%
B82YSpecific uses or applications of nanostructures4%
C07KPeptides4%
C12NMicroorganisms or enzymes4%
H01JElectric discharge tubes or discharge lamps4%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light4%
H04NPictorial communication, e.g. television4%
PatentTitleYear
10,730,852Method for producing 5-alkynyl pyridine compound202010,653,007Flexible printed circuit board202010,297,808Battery wiring module and power supply device provided with battery wiring module20199,618,190'LED module including flexible printed circuit board with adhesive layers and LED lighting fixture'20179,404,082'Method for production of eosinophil from pluripotent stem cell'20168,584,009'Automatically propagating changes in document access rights for subordinate document components to superordinate document components'20138,274,088'Surface-emitting laser element, fabrication method thereof, surface-emitting laser array, and fabrication method thereof'20128,155,163'Photonic crystal laser and method of manufacturing photonic crystal laser'20127,904,811'Text/image storage device, image reading device, and image forming apparatus'20117,476,909'Light emitting device'20097,172,867'Methods of testing for allergic diseases, and therapeutic agents for treating same'20077,115,373'Method of testing for atopic dermatitis by measuring expression of the NOR-1 gene'20066,641,861'Heatsink and fabrication method thereof'20036,618,539'Heater module and optical waveguide module'20036,361,857'Heatsink and fabrication method thereof'20026,335,863'Package for semiconductors, and semiconductor module that employs the package'20026,267,637'Electron-emitting element, method of making the same, and electronic device'20016,184,611'Electron-emitting element'20016,096,129'Method of and apparatus for producing single-crystalline diamond of large size'20005,336,081'Device and method for removing nitrogen oxides'19945,138,466'Facsimile apparatus'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1994–2016Based in Tokyo, JP· patent location history
2000–2020Patents assigned to SUMITOMO ELECTRIC INDUSTRIES (13)· patent assignee history
2000–2001Based in Hyogo, JP· patent location history
2002–2009Based in Itami, JP· patent location history
2006–2007Patents assigned to JAPAN AS REPRESENTED BY GENERA (2)· patent assignee history
2012–2016Patents assigned to SAITO HIROHISA (4)· patent assignee history
2012–2020Based in Osaka, JP· patent location history
2017–2020Patents assigned to SUMITOMO ELECTRIC PRINTED CIRCUITS INC (3)· patent assignee history
2019–2020Patents assigned to AUTONETWORKS TECHNOLOGIES LTD (2)· patent assignee history
2020Based in Funabashi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SUMITOMO ELECTRIC INDUSTRIES | 13 | 2000–2020 |
| SAITO HIROHISAself | 4 | 2012–2016 |
| SUMITOMO ELECTRIC PRINTED CIRCUITS INC | 3 | 2017–2020 |
| AUTONETWORKS TECHNOLOGIES LTD | 2 | 2019–2020 |
| JAPAN AS REPRESENTED BY GENERA | 2 | 2006–2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 6 | 1994–2016 |
| Osaka, JP | 5 | 2012–2020 |
| Itami, JP | 5 | 2002–2009 |
| Hyogo, JP | 3 | 2000–2001 |
| Funabashi, JP | 1 | 2020 |