Inventor
JHIH-YU WANG
Inventor
TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices33%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1033%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1033%
PatentTitleYear
12,412,867Integrated fan-out package and manufacturing method thereof202512,211,802Package structure and method of fabricating the same202512,205,903Semiconductor package and manufacturing method thereof202511,894,336Integrated fan-out package and manufacturing method thereof202411,854,997Method of forming semiconductor device202311,798,893Semiconductor package and manufacturing method thereof202311,694,967Package structure and method of fabricating the same202311,289,426Semiconductor package and manufacturing method thereof202211,276,647Method of forming semiconductor device2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 9 | 2022–2025 |