Inventor
Xuejun Lu
Inventor
Ottawa, CA
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H04Bprimary
H04BTransmission15%
H04WWireless communication networks13%
G06FElectric digital data processing9%
H03MCoding9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation9%
Y02DClimate change mitigation technologies in information and communication technologies [ict], i.e. information and communication technologies aiming at the reduction of their own energy use9%
G11CStatic stores8%
H01LSemiconductor devices8%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light6%
Y02BClimate change mitigation technologies related to buildings, e.g. housing, house appliances or related end-user applications4%
PatentTitleYear
11,128,314Error characteristic estimation for NAND flash202111,127,471Read retry threshold voltage selection202111,108,407Performance of a bit flipping (BF) decoder of an error correction system202111,082,071Quality of service (QoS) aware data storage decoder202111,082,062Hardware implementations of a quasi-cyclic syndrome decoder202111,057,058Quality of service of an adaptive soft decoder202110,849,063System and method for controlling a wireless network202010,763,382Backside configured surface plasmonic structure for infrared photodetector and imaging focal plane array enhancement202010,582,534Relay systems and methods for wireless networks202010,368,307System and method for controlling a wireless network201910,326,035Backside configured surface plasmonic structure for infrared photodetector and imaging focal plane array enhancement201910,147,528Non-oriented electrical steel sheet with fine magnetic performance, and calcium treatment method therefor201810,080,188System and method for controlling a wireless network20189,986,585Relay systems and methods for wireless networks20189,780,240'Backside configured surface plasmonic structure for infrared photodetector and imaging focal plane array enhancement'20179,537,027'Backside configured surface plasmonic structure for infrared photodetector and imaging focal plane array enhancement'20179,237,518'Power saving in wireless network entities'20168,923,180'Power saving in wireless network entities'20147,495,825'Integration of a gain equalization filter in a gain medium'20097,440,171'Staged amplifier for lower noise figure and higher saturation power'20087,235,852'Integrated variable optical attenuator'20077,236,700'Scalable and exchangeable erbium doped fiber amplifier for DWDM'20077,031,051'Dual fiber optic amplifier with shared pump source'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2009Patents assigned to FINISAR CORP (5)· patent assignee history
2006–2009Based in Fremont, CA, US· patent location history
2014–2020Patents assigned to CONVERSANT INTELLECTUAL PROPERTY MAN INC (7)· patent assignee history
2014–2020Based in Ottawa, CA· patent location history
2017–2020Patents assigned to UNIV MASSACHUSETTS (4)· patent assignee history
2017–2020Based in Chelmsford, MA, US· patent location history
2018Patents assigned to BOASHAN IRON & STEEL CO LTD (1)· patent assignee history
2018Based in Shanghai, CN· patent location history
2021Patents assigned to SK HYNIX INC (6)· patent assignee history
2021Based in San Jose, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CONVERSANT INTELLECTUAL PROPERTY MAN INC | 7 | 2014–2020 |
| SK HYNIX INC | 6 | 2021 |
| FINISAR CORP | 5 | 2006–2009 |
| UNIV MASSACHUSETTS | 4 | 2017–2020 |
| BOASHAN IRON & STEEL CO LTD | 1 | 2018 |
Locations
| Location | Patents | Span |
|---|---|---|
| Ottawa, CA | 7 | 2014–2020 |
| San Jose, California, US | 6 | 2021 |
| Fremont, California, US | 5 | 2006–2009 |
| Chelmsford, Massachusetts, US | 3 | 2017–2020 |
| Shanghai, CN | 1 | 2018 |