Inventor
Shang-Yun Tu
Inventor
Hsinchu, TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H01LSemiconductor devices44%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
10,629,509Redistribution circuit structures and methods of forming the same202010,037,973Method for manufacturing semiconductor package structure20189,991,218Connector structures of integrated circuits20189,659,903'Method of manufacturing connector structures of integrated circuits'20179,406,629'Semiconductor package structure and manufacturing method thereof'20169,373,598'Connector structures of integrated circuits'20169,093,440'Connector structures of integrated circuits'20158,729,699'Connector structures of integrated circuits'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (3)· patent assignee history
2014Patents assigned to CHEN CHEN-SHIEN (1)· patent assignee history
2014Patents assigned to CHUANG YAO-CHUN (1)· patent assignee history
2014Patents assigned to KUO CHEN-CHENG (1)· patent assignee history
2014–2020Based in Hsinchu, TW· patent location history
2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2016–2020 |
| TAIWAN SEMICONDUCTOR MFG | 3 | 2014–2016 |
| CHEN CHEN-SHIEN | 1 | 2014 |
| CHUANG YAO-CHUN | 1 | 2014 |
| KUO CHEN-CHENG | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 8 | 2014–2020 |