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Inventor

John A. Lebens

Inventor
Rush, NY, US

Overview

120→
Patents
1999–2017
Patent span
Performing operations
Primary field (CPC B)

Patents· 120 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary
B41JTypewriters41%
Y10TTechnical subjects covered by former us classification6%
H05KPrinted circuits6%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
G06FElectric digital data processing4%
G02BOptical elements, systems or apparatus3%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light3%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
B05DProcesses for applying fluent materials to surfaces, in general2%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%
PatentTitleYear
9,591,752'Articles with conductive micro-wire pattern'20179,506,891'Making imprinted thin-film electronic sensor structure'20169,328,253'Method of making electrically conductive micro-wires'20169,282,647'Method of making micro-channel structure for micro-wires'20169,226,411'Making multi-layer micro-wire structure'20159,186,698'Making imprinted multi-layer structure'20159,168,740'Printhead including acoustic dampening structure'20159,162,454'Printhead including acoustic dampening structure'20159,167,688'Micro-wire pattern for electrode connection'20159,155,201'Preparation of articles with conductive micro-wire pattern'20159,137,893'Micro-wire electrode buss'20159,131,606'Micro-channel pattern for effective ink distribution'20159,099,227'Method of forming conductive films with micro-wires'20159,085,699'Silver metal nanoparticle composition'20159,005,744'Conductive micro-wire structure'20158,865,292'Micro-channel structure for micro-wires'20148,828,536'Conductive article having silver nanoparticles'20148,828,275'Metal nanoparticle composition with water soluble polymer'20148,828,503'Making multi-layer micro-wire structure'20148,828,502'Making a conductive article'20148,820,883'Microfluidic device having improved epoxy layer adhesion'20148,806,751'Method of manufacturing printhead including polymeric filter'20148,652,765'Making a microfluidic device with improved adhesion'20148,608,288'Liquid drop ejector having self-aligned hole'20138,608,283'Nozzle array configuration for printhead die'20138,591,008'Liquid drop ejection using dual feed ejector'20138,585,913'Printhead and method of forming same'20138,567,912'Inkjet printing device with composite substrate'20138,562,120'Continuous printhead including polymeric filter'20138,540,349'Printhead having isolated heater'20138,529,021'Continuous liquid ejection using compliant membrane transducer'20138,496,318'Liquid drop ejection using dual feed ejector'20138,439,477'Method of characterizing array of resistive heaters'20138,434,855'Fluid ejector including MEMS composite transducer'20138,398,210'Continuous ejection system including compliant membrane transducer'20138,302,308'Method of forming a printhead'20128,300,269'Dot forming element arrays at different resolutions'20128,173,030'Liquid drop ejector having self-aligned hole'20128,167,406'Printhead having reinforced nozzle membrane structure'20127,857,422'Dual feed liquid drop ejector'20107,836,600'Fluid ejector having an anisotropic surface chamber etch'20107,731,341'Continuous fluid jet ejector with anisotropically etched fluid chambers'20107,699,441'Liquid drop ejector having improved liquid chamber'20107,607,227'Method of forming a printhead'20097,600,856'Liquid ejector having improved chamber walls'20097,399,068'Continuous ink jet printing apparatus with integral deflector and gutter structure'20087,370,944'Liquid ejector having internal filters'20087,354,522'Substrate etching method for forming connected features'20087,213,908'Fluid ejector having an anisotropic surface chamber etch'20077,191,520'Method of optmizing inkjet printheads using a plasma-etching process'20077,144,099'Liquid drop emitter with split thermo-mechanical actuator'20067,073,890'Thermally conductive thermal actuator and liquid drop emitter using same'20067,033,000'Tapered multi-layer thermal actuator and method of operating same'20067,029,101'Tapered multi-layer thermal actuator and method of operating same'20067,029,099'Method of producing ink jet chambers using photo-imageable materials'20067,025,443'Liquid drop emitter with split thermo-mechanical actuator'20067,012,942'Modulating the properties of the gain region at spaced locations in an organic vertical cavity laser array device'20067,011,394'Liquid drop emitter with reduced surface temperature actuator'20066,970,488'Tunable organic VCSEL system'20056,953,240'Snap-through thermal actuator'20056,948,800'Snap-through thermal actuator'20056,943,037'CMOS/MEMS integrated ink jet print head and method of forming same'20056,896,346'Thermo-mechanical actuator drop-on-demand apparatus and method with multiple drop volumes'20056,886,920'Thermal actuator with reduced temperature extreme and method of operating same'20056,879,306'Scanned display systems using color laser light sources'20056,879,618'Incoherent light-emitting device apparatus for driving vertical laser cavity'20056,869,185'Display systems using organic laser light sources'20056,870,868'Organic laser having improved linearity'20056,869,169'Snap-through thermal actuator'20056,824,249'Tapered thermal actuator'20046,820,964'Tapered thermal actuator'20046,817,702'Tapered multi-layer thermal actuator and method of operating same'20046,796,641'Continuous ink jet printer with micro-valve deflection mechanism and method of making same'20046,780,339'CMOS/MEMS integrated ink jet print head with oxide based lateral flow nozzle architecture and method of forming same'20046,721,082'Electrothermal diffraction grating'20046,721,020'Thermal actuator with spatial thermal pattern'20046,695,440'Continuous ink jet printer with micro-valve deflection mechanism and method of making same'20046,685,303'Thermal actuator with reduced temperature extreme and method of operating same'20046,676,249'Continuous color ink jet print head apparatus and method'20046,674,776'Organic vertical cavity lasing devices containing periodic gain regions'20046,663,788'Method for manufacturing a mechanical conformal grating device'20036,663,221'Page wide ink jet printing'20036,663,790'Method for manufacturing a mechanical conformal grating device with improved contrast and lifetime'20036,658,037'Incoherent light-emitting device apparatus for driving vertical laser cavity'20036,644,786'Method of manufacturing a thermally actuated liquid control device'20036,631,979'Thermal actuator with optimized heater length'20036,598,960'Multi-layer thermal actuator with optimized heater length and method of operating same'20036,588,890'Continuous inkjet printer with heat actuated microvalves for controlling the direction of delivered ink'20036,588,884'Tri-layer thermal actuator and method of operating'20036,578,955'Continuous inkjet printer with actuatable valves for controlling the direction of delivered ink'20036,572,220'Beam micro-actuator with a tunable or stable amplitude particularly suited for ink jet printing'20036,561,627'Thermal actuator'20036,536,873'Drop-on-demand ink jet printer capable of directional control of ink drop ejection and method of assembling the printer'20036,536,882'Inkjet printhead having substrate feedthroughs for accommodating conductors'20036,527,357'Assisted drop-on-demand inkjet printer'20036,521,513'Silicon wafer configuration and method for forming same'20036,520,629'Steering fluid device and method for increasing the angle of deflection of ink droplets generated by an asymmetric heat-type inkjet printer'20036,502,925'CMOS/MEMS integrated ink jet print head and method of operating same'20036,498,615'Ink printing with variable drop volume separation'20026,491,385'CMOS/MEMS integrated ink jet print head with elongated bore and method of forming same'20026,491,376'Continuous ink jet printhead with thin membrane nozzle plate'20026,474,794'Incorporation of silicon bridges in the ink channels of CMOS/MEMS integrated ink jet print head and method of forming same'20026,474,795'Continuous ink jet printer with micro-valve deflection mechanism and method of controlling same'20026,464,341'Dual action thermal actuator and method of operating thereof'20026,460,972'Thermal actuator drop-on-demand apparatus and method for high frequency'20026,450,619'CMOS/MEMS integrated ink jet print head with heater elements formed during CMOS processing and method of forming same'20026,435,666'Thermal actuator drop-on-demand apparatus and method with reduced energy'20026,426,237'Method for producing optically planar surfaces for micro-electromechanical system devices'20026,382,782'CMOS/MEMS integrated ink jet print head with oxide based lateral flow nozzle architecture and method of forming same'20026,284,560'Method for producing co-planar surface structures'20016,276,782'Assisted drop-on-demand inkjet printer'20016,252,697'Mechanical grating device'20016,238,581'Process for manufacturing an electro-mechanical grating device'20016,234,620'Continuous ink jet printer catcher and method for making same'20016,233,087'Electro-mechanical grating device'20016,126,270'Image forming system and method'20006,065,825'Printer having mechanically-assisted ink droplet separation and method of using same'20006,022,099'Ink printing with drop separation'20005,916,358'Ink compositions containing surfactant sols comprising mixtures of solid surfactants'19995,896,155'Ink transfer printing apparatus with drop volume adjustment'1999

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1999–2017Patents assigned to EASTMAN KODAK CO (120)· patent assignee history
1999–2017Based in Rush, NY, US· patent location history
2003Based in Rochester, NY, US· patent location history
2012–2014Patents assigned to LEBENS JOHN A (16)· patent assignee history
2012–2016Patents assigned to LEBENS JOHN ANDREW (16)· patent assignee history
2014–2016Patents assigned to WANG YONGCAI (14)· patent assignee history
2014–2016Patents assigned to TRAUERNICHT DAVID PAUL (9)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
EASTMAN KODAK CO1201999–2017
LEBENS JOHN Aself162012–2014
LEBENS JOHN ANDREWself162012–2016
WANG YONGCAI142014–2016
TRAUERNICHT DAVID PAUL92014–2016
Locations
LocationPatentsSpan
Rush, New York, US1191999–2017
Rochester, New York, US12003