Inventor
Myungsam Kang
Inventor
KR
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1038%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H01QAntennas, i.e. radio aerials3%
PatentTitleYear
12,593,684Semiconductor package including heat dissipation structure202612,519,051Semiconductor package device202612,394,708Semiconductor package202512,334,445Method of fabricating a semiconductor package202512,327,826Semiconductor package202512,278,191Semiconductor packages having wiring patterns202512,261,105Semiconductor package202512,183,665Semiconductor package202412,159,826Semiconductor package and method of manufacturing the semiconductor package202412,119,305Semiconductor package202412,094,817Semiconductor package202412,062,632Semiconductor package device202412,057,380Semiconductor package202412,046,562Semiconductor package202412,040,297Methods of manufacturing semiconductor packages202412,021,020Semiconductor package202412,002,798Fan-out type semiconductor package and method of manufacturing the same202411,935,847Semiconductor package202411,935,849Semiconductor package with an antenna substrate202411,916,002Semiconductor package202411,842,950Package module202311,837,537Fan-out semiconductor package202311,804,444Semiconductor package including heat dissipation structure202311,784,129Semiconductor package and method of fabricating the same202311,721,620Fan-out type semiconductor package202311,676,927Semiconductor package device202311,626,367Semiconductor package202311,581,284Semiconductor package with under-bump metal structure202311,569,158Semiconductor package202311,569,175Semiconductor package202311,562,966Semiconductor package202311,538,737Semiconductor package202211,527,495Semiconductor package with an antenna substrate202211,508,639System in package (SiP) semiconductor package202211,398,420Semiconductor package having core member and redistribution substrate202211,387,225Fan-out type semiconductor package and method of manufacturing the same202211,329,014Semiconductor package2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to SAMSUNG ELECTRONICS CO LTD (37)· patent assignee history
2022–2026Based in KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 37 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 37 | 2022–2026 |