Inventor

Glenn F. Urbish

Inventor

Coral Springs, FL, US

Overview

23→

Patents

1986–2001

Patent span

Electricity

Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits19%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

H01RElectrically-conductive connections8%

B29CShaping or joining of plastics6%

H01MProcesses or means, e.g. batteries, for the direct conversion of chemical energy into electrical energy6%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution6%

Y02PClimate change mitigation technologies in the production or processing of goods6%

G05BControl or regulating systems in general4%

H01QAntennas, i.e. radio aerials4%

B23KSoldering or unsoldering2%

PatentTitleYear

6,268,077'Portable fuel cell power supply'2001 6,025,804'Antenna with absorptive radiation shield'2000 5,774,341'Solderless electrical interconnection including metallized hook and loop fasteners'1998 5,761,093'Quality forecasting engine'1998 5,734,343'One-way optical highway communication system'1998 5,694,296'Multipoint electrical interconnection having deformable J-hooks'1997 5,662,946'Adaptable mold base'1997 5,659,478'Rapid product realization process'1997 5,639,416'Method of molding precision parts'1997 5,565,756'Microprocessor controlled portable battery charger and method of charging using same'1996 5,559,614'Liquid crystal display with integral heater and method of fabricating same'1996 5,446,625'Chip carrier having copper pattern plated with gold on one surface and devoid of gold on another surface'1995 5,338,391'Method of making a substrate having selectively releasing conductive runners'1994 5,313,365'Encapsulated electronic package'1994 5,280,139'Selectively releasing conductive runner and substrate assembly'1994 5,241,133'Leadless pad array chip carrier'1993 5,184,768'Solder interconnection verification'1993 5,136,365'Anisotropic conductive adhesive and encapsulant material'1992 5,001,038'Process for photoimaging a three dimensional printed circuit substrate'1991 4,939,792'Moldable/foldable radio housing'1990 4,894,663'Ultra thin radio housing with integral antenna'1990 4,877,569'Method of making a one-piece injection molded battery contact assembly'1989 4,598,972'High density electrical lead'1986

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1986–2001Patents assigned to MOTOROLA INC (23)· patent assignee history

1986–2001Based in Coral Springs, FL, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MOTOROLA INC	23	1986–2001

Locations

Location	Patents	Span
Coral Springs, Florida, US	23	1986–2001