Inventor
Akira Harao
Inventor
Makinohara-shi, JP
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits25%
H01RElectrically-conductive connections20%
H01LSemiconductor devices15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
Y10TTechnical subjects covered by former us classification15%
H01HElectric switches5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
PatentTitleYear
9,980,364Wiring substrate and manufacturing method thereof20189,888,558'Wiring substrate and manufacturing method thereof'20189,693,466'Wiring board and manufacturing method thereof'20179,480,142'Wiring substrate and manufacturing method thereof'20168,770,991'Fuse connection unit'20148,586,872'Metal core substrate'2013Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2013–2018Patents assigned to YAZAKI CORP (6)· patent assignee history
2013–2018Patents assigned to HARAO AKIRA (4)· patent assignee history
2013–2018Patents assigned to KUBOTA MINORU (3)· patent assignee history
2013–2018Based in Makinohara-shi, JP· patent location history
2017–2018Patents assigned to MATSUNAGA MOTOTATSU (2)· patent assignee history
2017Patents assigned to SANETO AKINORI (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| YAZAKI CORP | 6 | 2013–2018 |
| HARAO AKIRAself | 4 | 2013–2018 |
| KUBOTA MINORU | 3 | 2013–2018 |
| MATSUNAGA MOTOTATSU | 2 | 2017–2018 |
| SANETO AKINORI | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Makinohara-shi, JP | 6 | 2013–2018 |