Inventor
Masakatsu Maeda
Inventor
Kyoto, JP
Overview
Patents· 49 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
H03LAutomatic control, starting, synchronisation or stabilisation of generators of electronic oscillations or pulses6%
Y10TTechnical subjects covered by former us classification6%
C04BLime, magnesia5%
H05KPrinted circuits5%
H10HInorganic light-emitting semiconductor devices having potential barriers5%
H03CModulation4%
H03FAmplifiers4%
H04LTransmission of digital information, e.g. telegraphic communication4%
C08CTreatment or chemical modification of rubbers3%
PatentTitleYear
10,962,763Optical unit202110,948,024Clutch disc and torque limiter202110,899,156Manual binding tray for sheet processing device202110,325,162Detection device and detection method20199,654,063'Bias circuit for use with amplifier circuit, control method thereof, and signal amplifier'20179,148,089'Transmitting apparatus and transmission method'20159,130,610'Transmission apparatus and transmission method'20158,921,461'Epoxy resin composition and semiconductor device'20148,716,121'Ohmic electrode and method of forming the same'20148,697,803'Epoxy resin composition and semiconductor device'20148,633,101'Semiconductor device and manufacturing method of semiconductor device'20148,531,213'CMOS-inverter-type frequency divider circuit, and mobile phone including the CMOS-inverter-type frequency divider circuit'20138,519,067'Epoxy resin composition and semiconductor device'20138,508,303'Digital frequency/phase locked loop'20138,477,870'Transmitter including polar modulation circuit'20138,433,267'Amplitude modulator'20138,324,326'Epoxy resin composition and semiconductor device'20128,309,164'Metallized substrate and method for producing the same'20128,138,428'Lead-embedded metallized ceramics substrate and package'20128,115,114'Ceramic substrate manufacturing method and ceramic substrate'20128,071,187'Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package'20118,008,180'Method of forming an OHMIC contact on a P-type 4H-SIC substrate'20117,993,699'Process for producing metallized aluminum nitride substrate'20117,974,333'Semiconductor apparatus and radio circuit apparatus using the same'20117,973,481'Nitride sintered body and method for manufacturing thereof'20117,888,187'Element mounting substrate and method for manufacturing same'20117,879,705'Semiconductor devices and manufacturing method thereof'20117,876,053'Nitride sintered body and method for manufacturing thereof'20117,839,230'PLL oscillation circuit, polar transmitting circuit, and communication device'20107,825,422'Ceramic substrate for mounting a light emitting element and method for manufacturing the same'20107,742,543'Transmission circuit by polar modulation system and communication apparatus using the same'20107,737,461'Package for storing light emitting element and method for producing package for storing light emitting element'20107,734,263'Transmission circuit and communication device'20107,718,456'Package for housing light-emitting element and method for manufacturing package for housing light-emitting element'20107,609,123'Direct modulation type voltage-controlled oscillator using MOS varicap'20097,595,702'Modulation apparatus capable of correcting non-linearity of voltage controlled oscillator'20097,587,180'FM modulator'20097,339,420'Method of switching PLL characteristics and PLL circuit'20087,193,484'Voltage controlled oscillator apparatus'20077,110,486'Frequency synthesizer apparatus equipped with fraction part control circuit, communication apparatus, frequency modulator apparatus, and frequency modulating method'20067,050,525'Frequency synthesizer apparatus equipped with fraction part control circuit, communication apparatus, frequency modulator apparatus, and frequency modulating method'20066,717,998'Frequency synthesizer apparatus equipped with fraction part control circuit, communication apparatus, frequency modulator apparatus, and frequency modulating method'2004D0391721'Electric iron'19985,665,473'Package for mounting a semiconductor device'1997D0374322'Electric iron'1996D0360509'Steam iron'1995D0357384'Automatic bread maker'1995D0341516'Automatic bread maker'1993D0341515'Automatic bread maker'1993Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1993–2008Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (11)· patent assignee history
1993–1998Based in Nara, JP· patent location history
1997–2012Patents assigned to TOKUYAMA CORP (12)· patent assignee history
2004–2011Based in Kyoto, JP· patent location history
2009–2015Patents assigned to PANASONIC CORP (13)· patent assignee history
2010–2015Based in Osaka, JP· patent location history
2010–2012Based in Yamaguchi, JP· patent location history
2011–2014Patents assigned to MAEDA MASAKATSU (11)· patent assignee history
2012–2014Patents assigned to SUMITOMO BAKELITE CO (4)· patent assignee history
2012–2014Based in Tochigi, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| PANASONIC CORP | 13 | 2009–2015 |
| TOKUYAMA CORP | 12 | 1997–2012 |
| MAEDA MASAKATSUself | 11 | 2011–2014 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 11 | 1993–2008 |
| SUMITOMO BAKELITE CO | 4 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 9 | 2004–2011 |
| Osaka, JP | 7 | 2010–2015 |
| Yamaguchi, JP | 7 | 2010–2012 |
| Nara, JP | 6 | 1993–1998 |
| Tochigi, JP | 4 | 2012–2014 |