Inventor
Kinya Miyashita
Inventor
Kanagawa, JP
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1030%
Y10TTechnical subjects covered by former us classification19%
H02NElectric machines not otherwise provided for16%
B29CShaping or joining of plastics5%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts5%
B29LIndexing scheme associated with subclass b29c, relating to particular articles5%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests5%
B08BCleaning in general2%
B22DCasting of metals2%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling2%
PatentTitleYear
8,469,342'Substrate suction apparatus and method for manufacturing the same'20138,238,072'Bipolar electrostatic chuck'20128,196,594'Apparatus for removing foreign material from substrate and method for removing foreign material from substrate'20128,158,238'Electrostatic chuck and electrode sheet for electrostatic chuck'20128,051,548'Method of manufacturing an electrostatic chuck'20118,027,171'Feeding structure of electrostatic chuck, method for producing the same, and method for regenerating feeding structure of electrostatic chuck'20117,881,036'Electrode sheet for electrostatic chuck, and electrostatic chuck'20117,567,421'Bipolar electrostatic chuck'20097,411,773'Electrostatic chucking device and manufacturing method thereof'20087,300,707'Aluminium composite structure having a channel therein and method of manufacturing the same'20076,813,134'Electrostatic chucking device and manufacturing method thereof'20045,981,913'Static electricity chuck and wafer stage'19995,968,273'Wafer stage for manufacturing a semiconductor device'19995,667,822'Shaping mold for making ultra-thin shaped rubber articles'19975,595,704'Method of using a shaping mold for making ultra-thin shaped rubber articles'1997Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1997–2013Based in Kawasaki, JP· patent location history
1999–2011Based in Kanagawa, JP· patent location history
2004–2013Patents assigned to CREATIVE TECH CORP (11)· patent assignee history
2004–2008Patents assigned to KAWAMURA SANGYO CO LTD (2)· patent assignee history
2011–2012Based in Tokyo, JP· patent location history
2012–2013Patents assigned to MIYASHITA KINYA (4)· patent assignee history
2012Patents assigned to FUJISAWA HIROSHI (3)· patent assignee history
2012Patents assigned to HARANO RIICHIRO (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| CREATIVE TECH CORP | 11 | 2004–2013 |
| MIYASHITA KINYAself | 4 | 2012–2013 |
| FUJISAWA HIROSHI | 3 | 2012 |
| HARANO RIICHIRO | 2 | 2012 |
| KAWAMURA SANGYO CO LTD | 2 | 2004–2008 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kanagawa, JP | 6 | 1999–2011 |
| Kawasaki, JP | 5 | 1997–2013 |
| Tokyo, JP | 4 | 2011–2012 |