Inventor
Cheng-Hsien Chou
Inventor
Tainan, TW
Overview
Patents· 55 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices30%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation21%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1016%
H10DInorganic electric semiconductor devices14%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h109%
H10BElectronic memory devices4%
H05KPrinted circuits2%
H10HInorganic light-emitting semiconductor devices having potential barriers1%
Y10TTechnical subjects covered by former us classification1%
C23CCoating metallic material1%
PatentTitleYear
10,879,288Reflector for backside illuminated (BSI) image sensor202010,868,058Photodiode gate dielectric protection layer202010,734,285Bonding support structure (and related process) for wafer stacking202010,658,409Semiconductor structure and method of manufacturing the same202010,622,401Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same202010,541,297Semiconductor structure having integrated inductor therein202010,526,703Film formation apparatus for forming semiconductor structure having shower head with plural hole patterns and with corresponding different plural hole densities202010,522,487Semiconductor structure and manufacturing method thereof201910,522,5143DIC structure and methods of forming201910,504,716Method for manufacturing semiconductor device and manufacturing method of the same201910,325,956Deep trench isolation shrinkage method for enhanced device performance201910,325,949Image Sensor Device201910,319,768Image sensor scheme for optical and electrical improvement201910,283,550Semiconductor structure, back-side illuminated image sensor and method for manufacturing the same201910,204,822Method for forming trench liner passivation201910,177,106Conductive pad structure for hybrid bonding and methods of forming same201910,164,001Semiconductor structure having integrated inductor therein201810,163,947Photodiode gate dielectric protection layer201810,074,612Method for forming alignment marks and structure of same201810,050,0183DIC structure and methods of forming201810,043,841Image sensor device and method for forming the same201810,008,530Image sensing device and manufacturing method thereof201810,008,531Varied STI liners for isolation structures in image sensing devices20189,991,303Image sensor device structure20189,960,200Selective deposition and planarization for a CMOS image sensor20189,917,003'Trench liner passivation for dark current improvement'20189,859,323'Complementary metal-oxide-semiconductor (CMOS) image sensor'20189,842,816'Conductive pad structure for hybrid bonding and methods of forming same'20179,812,477'Photodiode gate dielectric protection layer'20179,786,619'Semiconductor structure and manufacturing method thereof'20179,754,993'Deep trench isolations and methods of forming the same'20179,704,904'Deep trench isolation structures and methods of forming same'20179,653,507'Deep trench isolation shrinkage method for enhanced device performance'20179,627,326'Method for forming alignment marks and structure of same'20179,437,572'Conductive pad structure for hybrid bonding and methods of forming same'20169,412,781'Photodiode gate dielectric protection layer'20169,355,964'Method for forming alignment marks and structure of same'20169,281,331'High dielectric constant structure for the vertical transfer gates of a complementary metal-oxide semiconductor (CMOS) image sensor'20169,147,710'Photodiode gate dielectric protection layer'20159,006,080'Varied STI liners for isolation structures in image sensing devices'20158,860,150'Metal gate structure'20148,816,439'Gate structure of semiconductor device'20148,404,535'Metal gate transistor and method for fabricating the same'20138,302,299'Method of manufacturing a multilayer printed circuit board with a built-in electronic device'20128,193,050'Method for fabricating semiconductor structure'20128,084,824'Metal gate transistor and method for fabricating the same'20117,998,818'Method for making semiconductor element structure'20117,932,146'Metal gate transistor and polysilicon resistor and method for fabricating the same'20117,888,195'Metal gate transistor and method for fabricating the same'20117,838,946'Method for fabricating semiconductor structure and structure of static random access memory'20107,834,276'Structure for connecting a USB communication interface in a flash memory card by the height difference of a rigid flexible board'20107,804,141'Semiconductor element structure and method for making the same'20107,799,630'Method for manufacturing a CMOS device having dual metal gate'20107,375,453'Surface acoustic wave substrate'20086,745,463'Manufacturing method of rigid flexible printed circuit board'2004Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2004Based in Tu-Cheng, TW· patent location history
2008–2020Based in Tainan, TW· patent location history
2010–2014Patents assigned to UNITED MICROELECTRONICS CORP (11)· patent assignee history
2010Based in Taipei, TW· patent location history
2011–2014Patents assigned to CHOU CHENG-HSIEN (6)· patent assignee history
2011–2014Patents assigned to YU CHIH-HAO (5)· patent assignee history
2011–2014Patents assigned to CHEN YI-WEN (4)· patent assignee history
2012Based in Zhonghe, TW· patent location history
2015–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (38)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 38 | 2015–2020 |
| UNITED MICROELECTRONICS CORP | 11 | 2010–2014 |
| CHOU CHENG-HSIENself | 6 | 2011–2014 |
| YU CHIH-HAO | 5 | 2011–2014 |
| CHEN YI-WEN | 4 | 2011–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tainan, TW | 52 | 2008–2020 |
| Zhonghe, TW | 1 | 2012 |
| Taipei, TW | 1 | 2010 |
| Tu-Cheng, TW | 1 | 2004 |