Inventor
Chi-Xiang Tseng
Inventor
Kaohsiung, TW
Overview
Patents· 23 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers27%
H01LSemiconductor devices19%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
F21KNon-electric light sources using luminescence8%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
F21VFunctional features or details of lighting devices or systems thereof5%
G02BOptical elements, systems or apparatus5%
F21SNon-portable lighting devices3%
G03BApparatus or arrangements for taking photographs or for projecting or viewing them3%
PatentTitleYear
9,412,915'Lighting apparatus'20169,373,758'Structure and method for LED with phosphor coating'20169,343,505'Wafer level reflector for LED packaging'20169,246,068'Method and apparatus for fabricating phosphor-coated LED dies'20169,214,610'Method and apparatus for fabricating phosphor-coated LED dies'20159,188,288'LED emitter with improved white color appearance'20159,105,818'Method and apparatus for fabricating phosphor-coated LED dies'20159,093,618'Method and apparatus for fabricating phosphor-coated LED dies'20159,082,942'Method and apparatus for packaging phosphor-coated LEDs'20159,035,334'Method and apparatus for fabricating phosphor-coated LED dies'20158,889,439'Method and apparatus for packaging phosphor-coated LEDs'20148,860,056'Structure and method for LED with phosphor coating'20148,835,202'Structure and method for LED with phosphor coating'20148,765,500'Method and apparatus for fabricating phosphor-coated LED dies'20148,757,845'Wide angle based indoor lighting lamp'20148,647,900'Micro-structure phosphor coating'20148,486,724'Wafer level reflector for LED packaging'20138,227,736'Image sensor device with silicon microstructures and fabrication method thereof'20128,164,042'Color filter arrays and image sensors using the same'20127,897,986'Microlens array and image sensing device using the same'20117,687,757'Design of microlens on pixel array'20107,270,457'Light source device and projector using the same'20077,036,937'Illuminating device reusing polarized light'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2012Based in Hsinchu, TW· patent location history
2007–2016Based in Kaohsiung, TW· patent location history
2010–2012Patents assigned to VISERA TECHNOLOGIES CO LTD (4)· patent assignee history
2012–2015Patents assigned to TSENG CHI-XIANG (4)· patent assignee history
2013–2016Patents assigned to TSMC SOLID STATE LIGHTING LTD (15)· patent assignee history
2013–2015Patents assigned to LEE HSIAO-WEN (6)· patent assignee history
2013–2014Patents assigned to TSENG CHI XIANG (4)· patent assignee history
2014Based in Kaoshiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TSMC SOLID STATE LIGHTING LTD | 15 | 2013–2016 |
| LEE HSIAO-WEN | 6 | 2013–2015 |
| TSENG CHI XIANGself | 4 | 2013–2014 |
| TSENG CHI-XIANGself | 4 | 2012–2015 |
| VISERA TECHNOLOGIES CO LTD | 4 | 2010–2012 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 17 | 2007–2016 |
| Hsinchu, TW | 5 | 2006–2012 |
| Kaoshiung, TW | 1 | 2014 |