Inventor

Cheng-Ying Ho

Inventor

Minxiong Township, TW

Overview

23→

Patents

2013–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 23 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%

H01LSemiconductor devices27%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation16%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%

H10DInorganic electric semiconductor devices5%

F24SSolar heat collectors3%

Y02EReduction of greenhouse gas [ghg] emissions, related to energy generation, transmission or distribution3%

C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%

G01BMeasuring length, thickness or similar linear dimensions2%

G01CMeasuring distances, levels or bearings2%

PatentTitleYear

11,074,393Method and apparatus to layout screens2021 11,060,864Controller for measuring distance from reference location and real size of object using a plurality of cameras2021 11,034,797Polyimide precursor composition, use thereof and polyimide made therefrom2021 10,935,281Solar thermal receivers with multi-scale light trapping geometry and features2021 10,914,493Multi-stage falling particle receivers2021 10,818,720Stacked image sensor having a barrier layer2020 10,629,568Stacked integrated circuits with redistribution lines2020 10,522,525Semiconductor device structure2019 10,510,7923DIC seal ring structure and methods of forming same2019 10,297,631Metal block and bond pad structure2019 10,283,547Stacked image sensor having a barrier layer2019 10,269,768Stacked integrated circuits with redistribution lines2019 9,887,182'3DIC structure and method for hybrid bonding semiconductor wafers'2018 9,818,735'Method of manufacturing a semiconductor device'2017 9,806,119'3DIC seal ring structure and methods of forming same'2017 9,666,566'3DIC structure and method for hybrid bonding semiconductor wafers'2017 9,536,920'Stacked image sensor having a barrier layer'2017 9,449,914'Stacked integrated circuits with redistribution lines'2016 9,437,578'Stacked IC control through the use of homogenous region'2016 9,142,690'Semiconductor device having a bonding pad and shield structure and method of manufacturing the same'2015 9,117,879'Semiconductor device and manufacturing method thereof'2015 8,710,612'Semiconductor device having a bonding pad and shield structure of different thickness'2014 8,502,389'CMOS image sensor and method for forming the same'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2015Patents assigned to TAIWAN SEMICONDUCTOR MFG (4)· patent assignee history

2013–2014Patents assigned to HO CHENG-YING (2)· patent assignee history

2013–2014Patents assigned to LIN JENG-SHYAN (2)· patent assignee history

2013–2014Patents assigned to LIU JEN-CHENG (2)· patent assignee history

2013–2020Based in Minxiong Township, TW· patent location history

2015–2019Based in Chiayi County, TW· patent location history

2016–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (14)· patent assignee history

2021Based in Palo Alto, CA, US· patent location history

2021Based in Albuquerque, NM, US· patent location history

2021Based in Kaohsiung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
TAIWAN SEMICONDUCTOR MFG CO LTD	14	2016–2020
TAIWAN SEMICONDUCTOR MFG	4	2013–2015
HO CHENG-YINGself	2	2013–2014
LIN JENG-SHYAN	2	2013–2014
LIU JEN-CHENG	2	2013–2014

Locations

Location	Patents	Span
Minxiong Township, TW	13	2013–2020
Chiayi County, TW	4	2015–2019
Palo Alto, California, US	2	2021
Albuquerque, NM, US	2	2021
Kaohsiung, TW	1	2021