Inventor
CHIH-CHIEH TSAI
Inventor
TW
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices27%
H10BElectronic memory devices27%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1015%
H10DInorganic electric semiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B08BCleaning in general4%
G11CStatic stores4%
PatentTitleYear
12,325,054Monitor wafer and method of using the same202512,075,613Buried word line of a dynamic random access memory and method for fabricating the same202411,877,433Storage node contact structure of a memory device202411,799,012Semiconductor device and method for fabricating the same202311,251,187Buried word line of a dynamic random access memory and method for fabricating the same202211,239,243Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same202211,239,241Bit line utilized in DRAM202211,222,784Semiconductor device and method for fabricating the same2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to UNITED MICROELECTRONICS CORP (8)· patent assignee history
2022–2024Patents assigned to FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD (7)· patent assignee history
2022–2025Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 8 | 2022–2025 |
| FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD | 7 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 8 | 2022–2025 |