Inventor
Tadafumi Yoshida
Inventor
Nisshin, JP
Overview
Patents· 30 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H02KDynamo-electric machines11%
H05KPrinted circuits11%
B60KArrangement or mounting of propulsion units or of transmissions in vehicles9%
Y02TClimate change mitigation technologies related to transportation9%
B60LPropulsion of electrically-propelled vehicles7%
B60WConjoint control of vehicle sub-units of different type or different function6%
H01LSemiconductor devices6%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application4%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems4%
PatentTitleYear
10,736,238Semiconductor device202010,165,701Electric power conversion device for providing a stabilized potential to a cooler20189,941,187Power converter and method for manufacturing power converter20189,768,095'Semiconductor device and manufacturing method thereof'20179,523,541'Cooling fin structure'20169,212,853'Cooler'20158,919,424'Semiconductor element cooling structure'20148,803,275'Semiconductor device including power semiconductor element, branch line, and thermoelectric conversion element, and electrically powered vehicle'20148,471,386'Junction body, semiconductor module, and manufacturing method for junction body'20138,446,727'Electronic component'20138,397,845'Drive apparatus for vehicle'20138,344,564'Drive device'20138,331,092'Cooling apparatus for semiconductor element'20128,291,967'Heat sink and cooler'20128,294,272'Power module'20128,272,462'Vehicle drive system'20128,251,131'Injection cooling heat exchanger for vehicle electrical components'20128,213,179'Semiconductor element cooling structure'20128,201,650'Drive device for hybrid vehicle'20128,148,859'Cooling structure for inverter and capacitor accommodated integrally with motor in housing of motor, motor unit with cooling structure, and housing'20128,125,078'Semiconductor element cooling structure'20128,058,849'Vehicle drive mechanism'20118,030,863'Motor drive device and vehicle provided with the same'20118,018,103'Driving mechanism'20117,977,830'Structure for mounting vehicle driving apparatus'20117,961,474'Heat dissipation device and power module'20117,932,624'Semiconductor module, and hybrid vehicle drive device including the same'20117,851,954'Vehicle drive device'20107,800,260'Vehicle driving apparatus'20107,377,745'Water pump'2008Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2008–2020Patents assigned to TOYOTA MOTOR CO LTD (30)· patent assignee history
2008–2014Based in Nisshin, JP· patent location history
2011–2016Patents assigned to YOSHIDA TADAFUMI (18)· patent assignee history
2011–2013Patents assigned to AISIN AW CO (6)· patent assignee history
2011–2013Based in Nissin, JP· patent location history
2011–2013Based in Toyota, JP· patent location history
2012–2014Patents assigned to OSADA HIROSHI (9)· patent assignee history
2012–2014Patents assigned to YOKOI YUTAKA (6)· patent assignee history
2012–2020Based in Kasugai, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TOYOTA MOTOR CO LTD | 30 | 2008–2020 |
| YOSHIDA TADAFUMIself | 18 | 2011–2016 |
| OSADA HIROSHI | 9 | 2012–2014 |
| AISIN AW CO | 6 | 2011–2013 |
| YOKOI YUTAKA | 6 | 2012–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Nisshin, JP | 16 | 2008–2014 |
| Kasugai, JP | 8 | 2012–2020 |
| Nissin, JP | 3 | 2011–2013 |
| Toyota, JP | 3 | 2011–2013 |