Inventor
Horng-Huei Tseng
Inventor
Hsinchu, TW
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices38%
H10DInorganic electric semiconductor devices31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1013%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation6%
PatentTitleYear
11,004,846Enlarging spacer thickness by forming a dielectric layer over a recessed interlayer dielectric202111,004,886Stacked grid design for improved optical performance and isolation202111,004,795Semiconductor structure and manufacturing method thereof202110,998,313Source/drain regions in fin field effect transistors (finFETs) and methods of forming same202110,957,777Semiconductor structure and manufacturing method thereof202110,943,901Semiconductor device and method2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (6)· patent assignee history
2021Patents assigned to TAIWAN SEMINCONDUCTOR MFG COMPANY LIMITE (1)· patent assignee history
2021Based in Hsinchu, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 6 | 2021 |
| TAIWAN SEMINCONDUCTOR MFG COMPANY LIMITE | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 6 | 2021 |