Inventor
Jae M. Park
Inventor
San Jose, CA, US
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1034%
H05KPrinted circuits16%
Y10TTechnical subjects covered by former us classification14%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B81BMicrostructural devices or systems, e.g. micromechanical devices2%
E02FDredging2%
E21BEarth or rock drilling2%
F21LLighting devices or systems thereof, being portable or specially adapted for transportation2%
F21SNon-portable lighting devices2%
F21YIndexing scheme associated with subclasses f21k, f21l, f21s and f21v, relating to the form or the kind of the light sources or of the colour of the light emitted2%
PatentTitleYear
10,865,603Core drill apparatus for installation in excavator20208,641,913'Fine pitch microcontacts and method for forming thereof'20148,604,348'Method of making a connection component with posts and pads'20138,207,604'Microelectronic package comprising offset conductive posts on compliant layer'20128,046,912'Method of making a connection component with posts and pads'20117,763,983'Stackable microelectronic device carriers, stacked device carriers and methods of making the same'20107,659,617'Substrate for a flexible microelectronic assembly and a method of fabricating thereof'20107,495,179'Components with posts and pads'20097,397,068'Solid state lighting device'20087,368,695'Image sensor package and fabrication method'20087,304,376'Microelectronic assemblies with springs'20077,268,304'Microelectronic connection components having bondable wires'20077,176,506'High frequency chip packages with connecting elements'20077,053,485'Microelectronic packages with self-aligning features'20065,173,392'Forming a pattern on a substrate'19925,122,439'Forming a pattern on a substrate'1992Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1992Patents assigned to IBM (2)· patent assignee history
1992Based in Binghamton, NY, US· patent location history
2006–2014Patents assigned to TESSERA INC (13)· patent assignee history
2006–2014Based in San Jose, CA, US· patent location history
2012–2014Patents assigned to HABA BELGACEM (3)· patent assignee history
2012–2014Patents assigned to PARK JAE M (3)· patent assignee history
2013–2014Patents assigned to KANG TECK-GYU (2)· patent assignee history
2020Based in Cheongju-si, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TESSERA INC | 13 | 2006–2014 |
| HABA BELGACEM | 3 | 2012–2014 |
| PARK JAE Mself | 3 | 2012–2014 |
| IBM | 2 | 1992 |
| KANG TECK-GYU | 2 | 2013–2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| San Jose, California, US | 13 | 2006–2014 |
| Binghamton, New York, US | 2 | 1992 |
| Cheongju-si, KR | 1 | 2020 |