Inventor
MICHIKO NATORI
Inventor
JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B22Fprimary
B22FWorking metallic powder18%
C22CAlloys18%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact12%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application12%
H01LSemiconductor devices12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1012%
B23KSoldering or unsoldering6%
H01BCables6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
PatentTitleYear
12,564,879Copper paste for joining, method for manufacturing joined body, and joined body202612,544,832Copper paste, wick formation method, and heat pipe202612,354,914Method for producing substrate having through-silicon vias, substrate having through-silicon vias, and copper paste for through-silicon via formation202512,233,460Copper paste, wick formation method, and heat pipe2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to RESONAC CORP (4)· patent assignee history
2025–2026Patents assigned to SHOWA DENKO MATERIALS CO LTD (2)· patent assignee history
2025–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| RESONAC CORP | 4 | 2025–2026 |
| SHOWA DENKO MATERIALS CO LTD | 2 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 4 | 2025–2026 |